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ICSIC 2015 : 2015 The 3rd International Conference on Solid-State and Integrated Circuit

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Link: http://www.icsic.org/
 
When Jul 1, 2015 - Jul 2, 2015
Where Bali, Indonesia
Submission Deadline Apr 15, 2015
Notification Due May 5, 2015
Final Version Due May 20, 2015
Categories    circuits   manufacturing   reliability   simulation
 

Call For Papers

2015 The 3rd International Conference on Solid-State and Integrated Circuit (ICSIC 2015)
1-2 July, 2015
Bali, Indonesia
http://www.icsic.org/


TOPICS:
(1) Silicon integrated circuits and manufacturing
(2) Digital, Analog, Mixed Signal IC and SOC design technology
(3) Low-power, RF devices & circuits
(4) IC Computer-Aided –Design technology, DFM
(5) Silicon/germanium devices and device physics
(6) Interconnect, Low K, High K and other process technologies
(7) Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)
(8) Unconventional and nano-electronics
(9) Organic semiconductor devices and technologies
(10) Compound semiconductor devices and circuits
(11) Displays, sensors and MEMS
(12) Semiconductor materials and material characterization
(13) Reliability
(14) Modeling and simulation
(15) Packaging and testing technology
(16) Equipment technology
(17) Solar cell & other devices for new energy sources
For more topics: http://www.icsic.org/cfp.html

Publication:
All accepted papers of ICSIC 2015 will be published by Applied Mechanics and Materials Journal (ISSN: 1660-9336), Indexing: Volumes are submitted for indexing to Elsevier: SCOPUS and Ei Compendex (CPX). Cambridge Scientific Abstracts (CSA), Chemical Abstracts (CA), Google and Google Scholar google.com, ISI (ISTP, CPCI, Web of Science), Institution of Electrical Engineers (IEE), etc. (quoted from TTP)

Submission method:
Electronic Submission System; ( .pdf)
http://www.easychair.org/conferences/?conf=icsic2015

Contact us:
Ms. Teresa Zhang
Email:icsic@iacsit.org
Tel: +1-518-478-2659
+8628-8652-8758
IACSIT website: http://iacsit.org/

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