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NOCS 2014 : International Symposium on Networks-on-Chip

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Conference Series : Networks-on-Chips
 
Link: http://mpsoc.unife.it/~nocsymposium/callforpapers.html
 
When Sep 17, 2014 - Sep 19, 2014
Where Ferrara, Italia
Abstract Registration Due Feb 23, 2014
Submission Deadline Mar 2, 2014
Notification Due May 5, 2014
Final Version Due Jun 2, 2014
 

Call For Papers

The International Symposium on Networks-on-Chip (NOCS) is the premier event dedicated to interdisciplinary research on on-chip, chip-scale, and multichip package-scale communication technology, architecture, design methods, applications and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from inter-related research communities, including computer architecture, networking, circuits and systems, packaging, embedded systems, co-design, and design automation. Topics of interest include, but are not limited to:

NoC Architecture and Design
Network architecture (topology, routing, arbitration)
NoC Quality of Service
Timing, synchronous/asynchronous communication
Network interface issues
NoC design methodologies and tools
Mapping of applications onto NoCs
Signaling & circuit design for NoC links
NoC Application
NoC case studies
application-specific NoC designs
NoC designs for heterogeneous many-core systems, fused CPU-GPU architectures, FPGA-based systems etc
NoC Analysis, Verification and Modeling
NoC Analysis, Verification and Modeling
Modeling, simulation, and synthesis of NoCs
Verification, debug & test of NoCs
Metrics and benchmarks for NoCs
Scalable modeling of NoCs
NoC at the Un-Core and System-level
Design of memory subsystem (un-core) including memory controllers, caches, cache coherence protocols & NoCs
NoC support for memory and cache access
OS support for NoCs
Programming models including shared memory, message passing and novel models
Issues related to large-scale systems (datacenters, supercomputers) with NoC-based systems as building blocks
Novel NoC Technologies
New physical interconnect technologies, e.g., carbon nanotubes, wireless NoCs, through-silicon, etc.
NoCs for 3D and 2.5D packages
Package-specific NoC design
Optical, RF, & emerging technologies for on-chip/in-package interconnects
NoC Optimization
for power/energy efficiency
for thermal efficiency and darksilicon
for dependable architectures
for communication efficient algorithms

Submission Rules
Electronic paper submission requires a full paper, up to 8 double-column IEEE format pages, including figures and references. The program committee in a double-blind review process will evaluate papers based on scientific merit, innovation, relevance, and presentation. Submitted papers must describe original work that has not been published before or is under review by another conference at the same time. Each submission will be checked for any significant similarity to previously published works or for simultaneous submission to other archival venues, and such papers will be rejected. Please see the paper submission instructions for details. This year will also include an industrial session on the architecture of future NoC platforms. The objective of this session is to provide a forum for industry leaders to share their experiences and perspectives on the technical challenges facing future platforms and discuss potential solutions. Check the submission page for details on submissions to this session. The session will feature a small number of papers (3-5) covering experiences from industrial design and development.

Proposals for tutorials, special sessions, and panels are also invited. Please see the detailed submission instructions for paper, tutorial, special sessions, and panel proposals at the submission page.


Important Dates
Abstract registration deadline February 23, 2014
Full paper submission deadline May 5, 2014
Notification of acceptance March 2, 2014
Final version due June 2, 2014
Industry Session submission deadline March 23, 2014
Proposals for tutorials, special sessions and panels Jan 11, 2014
Contact Information
Davide Bertozzi, University of Ferrara, davide.bertozzi@unife.it
Luca Benini, University of Bologna, luca.benini@unibo.it
Joerg Henkel, Karlsruhe Institute of Technology, henkel@kit.edu
Sudhakar Yalamanchili, Georgia Institute of Technology, sudha@gatech.edu

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