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VLSI-SoC 2014 : 22nd IFIP/IEEE International Conference on Very Large Scale Integration

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Conference Series : Very Large Scale Integration of System-on-Chip
 
Link: http://www.vlsi-soc.com
 
When Oct 6, 2014 - Oct 8, 2014
Where Playa del Carmen, Mexico
Submission Deadline Apr 4, 2014
Notification Due Jun 13, 2014
Final Version Due Jun 27, 2014
Categories    VLSI   circuits   embedded systems   EDA
 

Call For Papers

22nd IFIP/IEEE International Conference on Very Large Scale Integration
VLSI-SoC 2014
October 6-8, 2014
Playa del Carmen, Mexico
Iberostar Tucán and Quetzal Hotel

VLSI-SoC 2014 is the 22nd in a series of international conferences sponsored by IFIP TC 10 Working Group 10.5, IEEE CEDA and IEEE CASS, which explores the state-of-the-art in the areas that surround Very Large Scale Integration (VLSI) and System-on-Chip (SoC). Previous conferences have taken place in Edinburgh, Trondheim, Tokyo, Vancouver, Munich, Grenoble, Gramado, Lisbon, Montpellier, Darmstadt, Perth, Nice, Atlanta, Rhodes, Florianópolis, Madrid, Hong Kong, Santa Cruz and Istanbul. The purpose of VLSI-SoC is to provide a forum to exchange ideas and showcase research as well industrial results in EDA, design methodology, test, design, verification, devices, process, systems issues and application domains of VLSI and SoC.

Paper Submission: Papers should present original research and industrial results not published or submitted for pub- lication in other forums. Electronic submission in PDF for- mat to the http://www.vlsi-soc.com website is required. The proceedings will be published by IEEE and available through IEEE Xplore.

A selection of the conference best papers will be invited to submit an extended version to be included as chapters of a book to be published by Springer.
Paper Format: Papers should not exceed 6 pages (single- spaced, 2 columns, 10pt font). Submissions should be in camera-ready, following the IEEE proceedings specifica- tions located at:

http://www.ieee.org/web/publications/pubservices/confpub/AuthorTool/conferenceTemplates.html

Paper Publication and Presenter Registration: Papers will be accepted for regular or poster presentation at the confer- ence. Every accepted paper MUST have at least one au- thor registered at the conference by the time the camera- ready paper is submitted; the author is also expected to attend the conference and present the paper. A limited number of travel grants are available to needy PhD stu- dents. Please see the web site for more information.

Topics of interest include but are not limited to:
• Analog and Mixed-Signal IC Design
• 3-D Integration
• Physical Design
• SoC Design for Variability, Reliability, Fault Tolerance and Test • New Devices, MEMS, and Microsystems
• Digital Signal Processing and Image Processing SoC Design
• Prototyping, Validation, Verification, Modelling, and Simulation
• Embedded Systems and Processors, Hardware/Software Codesign • Processor Architectures and Multicore SOCs
• Logic and High-Level Synthesis
• Low-Power and Thermal-aware Design
• Reconfigurable SoC Systems for Energy and Reliability
• Dependable SoCs
• SoC in the Dark Silicon Era
• Green Computing Systems
• Low Energy Secure Systems
• Circuits and Systems for Micro-sensing Applications

General Chairs:
Arturo Sarmiento Reyes, INAOE, Mexico
Ricardo Reis, UFRGS, Brazil

Program Chairs:
Luc Claesen, Univ. Hasselt, Belgium
María Teresa Sanz, INAOE, México

Special Sessions Chair:
Salvador Mir, TIMA, France

Local Arrangement Chair:
Gabriela López, INAOE, Mexico

Publication Chairs:
Lorena García, UNIANDES, Colombia

Publicity Chair:
Michael Hübner, Ruhr Univ. Bochum, Germany

Registration Chair:
Roberto Murphy, INAOE, Mexico

Finance Chair:
Roberto Murphy, INAOE, Mexico

PhD Forum Chair:
Srinivas Katkoori, USF, USA
Reydezel Torres, INAOE, México

Steering Committee:
Manfred Glesner, TU Darmstadt, Germany
Matthew Guthaus, UC Santa Cruz, USA
Salvador Mir, TIMA, France
Ricardo Reis, UFRGS, Brazil
Michel Robert, U. Montpellier, France
Luis Miguel Silveira, INESC ID, Portugal
Chi-Ying Tsui, HKUST, Hong Kong, China

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