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HPBD&IS 2021 : 3rd International Conference on High Performance Big Data and Intelligent Systems


When Dec 5, 2021 - Dec 7, 2021
Where Macau, China
Submission Deadline Oct 31, 2021
Notification Due Nov 15, 2021
Final Version Due Nov 20, 2021
Categories    big data   computer vision   blockchain   intelligent manufacturing

Call For Papers

High-quality original submissions are welcome from research results and applications of all areas of High-Performance Computing, Big Data & Intelligence Systems. All papers will be reviewed based on technical quality, relevance, originality, significance, and clarity. After a careful review process, all accepted papers will be published in the conference proceedings of HPBD&IS 2021. Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

A PDF version of this call-for-papers is at

Topics of interest include, but are not limited to:

1.High Performance Computing Technology and Its Applications

·High Performance Computer Architecture
·High Performance Computer System Software
·High Performance Computing Environments
·High Performance Micro Processor
·High Performance Storage Technology
·Multi-Core and Multi-Threaded Architecture Methods
·Architecture, Software and Algorithm of Parallel and Distributed System
·High Performance Ubiquitous Computing
·High Performance Adaptive and Evolutionary Computing
·High Performance Blockchain Technology
·High Performance Application
·Parallel Processing of Big Data
·Hardware/OS Acceleration for Big Data

2.Big Data Technology and Its Applications

·Big Data Model, Processing Algorithm and Programming Technology
·Representation of Multimedia Big Data
·Big Data Learning and Analytics
·Big Data Durability and Storage
·Big Data Quality and Source Control
·Big Data Protection Integrity and Privacy
·Big Data Storage and Computing Fusion Technology
·Big Data Search and Mining
·Big Data Management and Visualization Analytics
·Big Data Business Model Innovation
·Big Data Applications

3.Intelligent Systems

·Neural Network and Learning Systems
·Computer Vision
·Robotic Science and Control Engineering
·Smart Sensor and Sensor Fusion
·Intelligent Storage Device and System
·Real Time System
·Blockchain System
·Adaptive System
·Complex Systems and Networks
·Intelligent Manufacturing
·Pattern Recognition
·Simultaneous Localization and Mapping

Submission Guidelines

Please prepare your full paper according to the Manuscript Templates. All final submissions should be written in English with a maximum paper length of five (5) printed pages (including figures, tables, and references). If the paper exceeds 5 pages, extra pages should be paid. Templates are available for Microsoft Word and LaTeX in the IEEE 2-column format. All papers must be submitted electronically through the paper Submission System.

If required supplementary material may be submitted as a separate PDF file, but reviewers are not obligated to consider this, and your manuscript should, therefore, stand on its own merits without any supplementary material. Supplementary material will not be published in the proceedings.

The conference peer review process will take 2-3 weeks from submission to a decision notification.

The submitted papers must not be previously published anywhere and must not be under consideration by any other conference or journal during the HPBD&IS review process. Submitting a paper to the conference means that if the paper was accepted, at least one author will complete the registration.

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IEEE Xplore-Ei/Scopus-CCCAI 2023   2023 International Conference on Communications, Computing and Artificial Intelligence (CCCAI 2023) -EI Compendex
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