posted by user: onigas || 5837 views || tracked by 7 users: [display]

MIXDES 2010 : 17th International Conference on Mixed Design of Integrated Circuits and Systems

FacebookTwitterLinkedInGoogle

Link: http://www.mixdes.org
 
When Jun 24, 2010 - Jun 26, 2010
Where Wroclaw, Poland
Submission Deadline Feb 28, 2010
Notification Due Apr 19, 2010
Final Version Due May 15, 2010
Categories    circuits   integrated circuits
 

Call For Papers

The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to continue the tradition of inviting you to the most attractive places in Poland and the will take place in Wrocław.
The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices.

The MIXDES conference papers are indexed in Thomson Reuters Conference Proceedings Citation Index and available in IEEE Xplore since MIXDES 2005.

The topics of the MIXDES 2010 Conference include:

1. Design of Integrated Circuits and Microsystems
Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.

2. Thermal Issues in Microelectronics
Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.

3. Analysis and Modelling of ICs and Microsystems
Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.

4. Microelectronics Technology and Packaging
New microelectronic technologies. Packaging. Sensors and actuators.

5. Testing and Reliability
Design for testability and manufacturability. Measurement instruments and techniques.

6. Power Electronics
Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.

7. Signal Processing
Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.

8. Embedded Systems
Design, verification and applications.

9. Medical Applications
Medical and biotechnology applications. Thermography in medicine.

Related Resources

SI: AI for Control Systems 2027   Special Issue on Applied Artificial Intelligence for Control Systems (Electronics, MDPI)
EEMS--EI 2027   2027 2nd International Conference on Electromagnetic Engineering & Microwave Systems (EEMS 2027)
ISRASC 2026   2026 International Symposium on Robotics, Autonomous Systems and Control
SMAICT 2026   2026 International Conference on Semiconductor Materials and Advanced Integrated Circuit Technology
IJAIA 2026   International Journal of Artificial Intelligence & Applications - H Index - 41
ICCSS 2027   2027 The 10th International Conference on Circuits, Systems and Simulation (ICCSS 2027)
Eco-Conservation and Belief Systems 2027   ICSSR Sponsored Two-day National Conference titled Eco-Conservation and Indigenous Belief Systems in India
IEEE ICCCAS 2027   IEEE--2027 16th International Conference on Communications, Circuits, and Systems (ICCCAS 2027)
AI for Chip Design at NeurIPS 2026   AI for Chip Design Workshop at NeurIPS 2026
ACEE--EI 2027   2027 4th Asia Conference on Electronics Engineering (ACEE 2027)