ASQED 2013 strives to bridge the gap among electronic design tools and processes, integrated circuit technologies, processes & manufacturing, to achieve design and intends to highlight and accelerate cooperation among the IC design, EDA, Semiconductor Process Technology, IC Packaging, Test, and Manufacturing communities. ASQED’12 spans two days, in four parallel tracks, hosting near 100 technical presentations, several keynote speakers, tutorials and other informal meetings. Conference Proceedings will be published by IEEE and posted in the IEEE digital library

Papers are requested in the following areas

As a premier Asia Symposium, ASQED 2013 accepts and promotes papers related to circuit and system design (digital, analog, RF, and mixed-signal), semiconductor manufacturing, advanced IC Packaging, Test, Electronic Design Automation (EDA), as well as emerging semiconductor nano/bio-technologies, and photovoltaic electronics. Topics of interest for paper submission are as follows:
•IC Packaging Technology
•PCB and PWB Technology & Manufacturing
•Circuit & System Design
•Test & Verification
•Semiconductor & Nano Technology
•Bio Electronics Innovations
•Photovoltaic Technology & Manufacturing
•Electronic Design Automation Methodologies
•Micro-Electro-Mechanical System (MEMS)

Submission of Papers

Paper submission must be done on-line through the conference web site at https://www.softconf.com/d/asqed2013 . The guidelines for the final paper format are provided on the symposium website. Authors should submit FULL-LENGTH, original, unpublished papers (Minimum 4, maximum 10 pages) along with abstract of about 200 words. Please check the as-printed appearance of your paper before sending your paper. In case of any problems, email info@asqed.com. Report all other problems and questions to asqed2013@asqed.com