International Journal of Microelectronics Engineering (IJME) Scope and TopicsInternational Journal of Microelectronics Engineering invites high quality manuscripts in the research areas of analog and digital circuit design methodologies. This journal provides a worldwide, regular and comprehensive update on microelectronics engineering. Journal invites significant research and application papers in all the areas listed below. The comprehensive review papers covering recent developments will also be considered. Topics of interest include but are not limited to, the following - Semiconductor Devices and Modeling
- Mixed-Domain Simulation and Design
- Microelectronics and VLSI Circuits
- Deposition/Growth, Photolithography/Patterning
- Device Simulation and Modeling of VLSI/CMOS/Unconventional Devices
- Emerging and Advanced Fabrication Methodologies
- Logic, Architectural and System Level Synthesis
- Area, Power and Thermal Evaluation
- New Device Structures
- Nonconventional Devices: OTFTs, CNTFETs, Multigate FETs Tunnel FETs
- Display Technology
- Organic and Molecular Flexible Electronics
- Embedded Systems
- Emerging Devices and Circuits
- Design of Semiconductor Memories
- System on Chip Design
- Testing, Design for Testability
- Low Power VLSI Design
- Quantum Computing and Nano-Technology
- Micro Sensors and MEMS
- Beyond CMOS Devices
Paper SubmissionAuthors are invited to submit papers for this journal through E-mail journalijme@airccse.com. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this Journal. Important Dates| Submission Deadline | : | April 25, 2026 | | Authors Notification | : | May 25, 2026 | | Final Manuscript Due | : | June 01, 2026 | | Publication Date | : | Determined by the Editor-in-Chief |
Editor in ChiefEditorial Board Members - Alireza Azarhoosh, Amirkabir University of Technology, Iran
- Ashwani Kumar Arya, KAIST, South Korea
- Ahmad Ihsan Mohd Yassin, Universiti Teknologi Mara, Malaysia
- Deepak B.B.V.L, National Institute of Technology, India
- Bozidar Sarler, University of Nova Gorica & Institute of Metals and Technology, Slovenia
- Byungtae Lee, KAIST Venture Investment Holdings, South Korea
- Chandrashekhar Badgujar, Mumbai University, India
- Emeka E. Okwueze Fnip, University of Calabar, Calabar - Nigeria
- Ged Griffin, University of Melbourne, Australia
th Korea Ahmad Ihsan Mohd Yassin, Universiti Teknologi Mara, MalaysiaDeepak B.B.V.L, National Institute of Technology, IndiaBozidar Sarler, University of Nova Gorica & Institute of Metals and Technology, SloveniaByungtae Lee, KAIST Venture Investment Holdings, South KoreaChandrashekhar Badgujar, Mumbai University, IndiaEmeka E. Okwueze Fnip, University of Calabar, Calabar - NigeriaGed Griffin, University of Melbourne, Australia
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