posted by user: FUN0524 || 1428 views || tracked by 1 users: [display]

IEEE NMDC--EI Compendex, Scopus 2020 : 2020 15th IEEE Nanotechnology Materials and Devices Conference (IEEE NMDC 2020)--EI Compendex, Scopus

FacebookTwitterLinkedInGoogle

Link: http://www.nmdc2020.org
 
When Oct 18, 2020 - Oct 21, 2020
Where Nanjing, China
Submission Deadline Apr 30, 2020
Categories    materials science   industrial engineering   engineering   electrical engineering
 

Call For Papers

2020 15th IEEE Nanotechnology Materials and Devices Conference (IEEE NMDC 2020)--EI Compendex, Scopus

2020 15th IEEE Nanotechnology Materials and Devices Conference is to be held in【Holiday Inn Nanjing Qinhuai South, Nanjing, China】during Oct. 18-21, 2020.
The conference is sponsored by Nanotechnology Council; Southeast University, China; and IEEE.
Details please visit: http://www.nmdc2020.org

▼Publications
Conference papers will be published in IEEE Xplore.
Authors of selected papers will be invited to submit their extended article version to: IEEE Transactions on Nanotechnology, and IEEE Nanotechnology Magazine.
Best paper awards will be given in several categories at the conference banquet.

▼Organizers & Committees
Honorary Chairmen: Prof. Wei Huang, CAS Academician
Prof. C. G. Willson, NAE
Advisory Committee:Prof. Huiming Chen, CAS Academician
Prof. Ze Zhang, CAS Academician
General Chair: Prof. Li Tao, Southeast University, China
Technical Program Chair: Prof. Xiaogan Liang, University of Michigan, USA
Conference Co-Chairs: Prof. Walter Hu, The University of Texas at Dallas, USA
Prof. Cinzia Casiraghi, The University of Manchester, UK

▼Call for Paper
Prospective authors are invited to submit research papers in the following areas, but not limited to
Low dimensional Materials
Neuromorphic & AI Devices
2D Micro/Nano Electronics
New Energy Materials & Devices
Wearable & Printed Electronics
Nano-Biomedicine & Healthcare
Quantum and Beyond Devices
Nano Fabrication and Integration
Internet of Things NanoDevices
Virtual/Mixed Reality NanoDevices
MEMS/NEMS and Nanomechanics
Device Passivation & Packaging

▼Submission Options
A. Regular papers submission
B. Invited presentation submission
Details please visit: 【http://www.nmdc2020.org/sub_option.html】

▼Submission Process
Online submission system: https://easychair.org/conferences/?conf=nmdc2020

▼History of NMDC
NMDC 2019-Stockholm, Sweden
NMDC 2018-Portland, Oregon, USA
NMDC 2017-Singapore
NMDC 2016-Toulouse, France

▼Conference Venue
Holiday Inn Nanjing Qinhuai South
Addr.: NO.21 Mozhou East Road, Jiangning District, Nanjing, JS, 211111, China


▼Contact
Conference Coordinator
Assoc. Prof. Jing BAI
Southeast University, China
Email: baijing@seu.edu.cn

Conference Secretary
Ms. Frannie Li
Email: ieee_nmdc2020@young.ac.cn
Tel:+86-13281280917
working time: 09:30-18:00 (Monday-Friday)

If you have any query about the cnference or need help, please contact the conference secretary.

Related Resources

IEEE--SEGE--EI Compendex, Scopus 2022   IEEE--2022 10th International Conference on Smart Energy Grid Engineering (SEGE 2022)--EI Compendex, Scopus
CoMSE 2022   2022 International Conference on Materials Science and Engineering (CoMSE 2022)
IEEE--PRAI--Scopus, Ei 2022   IEEE--2022 the 5th International Conference on Pattern Recognition and Artificial Intelligence (PRAI 2022)--Scopus, Ei Compendex
MoWiN 2022   11th International Conference on Mobile & Wireless Networks
IEEE--ICIVC--Ei Compendex, Scopus 2022   IEEE--2022 7th International Conference on Image, Vision and Computing (ICIVC 2022)--Ei Compendex, Scopus
ISCSO 2021   Optimization Competition
IEEE MAPE--EI Compendex, Scopus 2022   2022 IEEE the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (IEEE MAPE 2022)--EI Compendex, Scopus
CSEIJ 2021   Computer Science & Engineering: An International Journal
PRAI--IEEE, Scopus, Ei 2022   IEEE--2022 the 5th International Conference on Pattern Recognition and Artificial Intelligence (PRAI 2022)--Scopus, Ei Compendex
MLAIJ 2021   Machine Learning and Applications: An International Journal