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CII 2011 : 2011 IEEE Symposium on Computational Intelligence and Industry

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Link: http://www.ieee-ssci.org/2011/cii-2011
 
When Apr 11, 2011 - Apr 15, 2011
Where Paris, France
Submission Deadline Oct 31, 2010
Notification Due Dec 15, 2010
Final Version Due Jan 15, 2011
Categories    computational intelligence   artificial intelligence   industry applications
 

Call For Papers

Part of IEEE Symposium Series on Computational Intelligence 2011

Computational Intelligence (CI) techniques have been widely and successfully applied to solve a variety of real-world problems in industry and defense. Nevertheless, several practical reasons do exist that prevent engineers from adopting most advanced CI techniques in their daily work. The main motivation of this symposium is to promote and strengthen the connections between academia, industry and government agencies through providing easily comprehensible tutorials, presenting successful application examples in industry and brain-storming discussions on how to make CI techniques to accessible to engineering and practitioners.


Topics of the symposium include, but are not limited to:

* Industry-related research and development using CI techniques
o Application of CI techniques for solving complex real-world problems in industry
o Results from industry-financed CI research projects
o Results from industry-led or industry-participated projects financed by government agencies and / or industry
* Technology transfer issues
o Assessment of the technology maturity level, e.g., using standards such as the Technology Readiness Levels (TRL’s) source: http://www.sei.cmu.edu/pub/documents/02.reports/pdf/02sr027.pdf
o Analysis of CI related IP landscape
o Best practices
o Integration of CI with traditional technologies
* Communication between industry, academia and government
* Large CI research groups in industry
o Guidelines and research opportunities at NSF and other government agencies
o Large application-oriented CI research groups at academia
o IEEE CIS supported activities that promote CI applications, including establishing CI related MSc program and summer schools
* Software and methodologies that enhance the accessibility of engineers to CI techniques
o User-friendly software for application CI techniques
o Training programs on CI related techniques
o CI models lifecycle support: How do you support deployed CI models over time to prevent obsolescence? How do we enable others (maybe IT technicians) to do it?


Symposium Co-Chairs

Yaochu Jin, Honda Research Institute Europe, Germany
Piero P. Bonissone, GE Global Research, USA
Jennie Si, Arizona State University, USA


Program Committee

Angelov Plamen, Lancaster University, UK
Tao Ban, National Institute of Information and Communications Technology, Japan
Piero Bonissone, General Electric Global Research, USA
Pei-Chann Chang, Yuan Ze University, Taiwan, ROC
Carlos A. Coello Coello, CINVESTAV-IPN, Mexico
Fahmida N. Chowdhury, National Science Foundation, USA
Dimitar P. Filev, Ford Research & Advanced Engineering, Dearborn, USA
Gary Fogel, Natural Selection Inc., USA
Michael Gienger, Honda Research Institute Europe, Germany
Chi Keong Goh, Rolls-Royce Singapore Pte Ltd, Singapore
Anthony (Tony) J. Grichnik, Caterpillar Inc., USA
Robert Golan, DBmind Technologies Inc, USA
Hani Hagras, University of Essex, UK
Moufid Harb, Larus Technologies, Canada
Xiao Hu, General Electronic Global Research, USA
Yaochu Jin, Honda Research Institute, Germany
Bob John, De Montfort University, UK
Graham Kendall, University of Nottingham, UK
Nikola Kasabov, Auckland University of Technology, New Zealand
Arthur Kordon, Dow Chemical Company, USA
Xuelong Li, Birkbeck College, University of London, UK
Yan Liu, Motorola Labs, USA
Zbigniew Michalewicz, University of Adelaide, Australia
Luis Magdalena, European Centre for Soft Computing, Spain
Yan Meng, Stevens Institute of Technology, USA
Yi Lu Murphey, The University of Michigan-Dearborn, USA
Hiroshi Nakajima, OMRON Corporation, Japan
Detlef D Nauck, BT Innovate & Design, UK
Tatsuya Okabe, Honda R&D, Japan
Yew Soon Ong, Nanyang Technological University, Singapore
Thomas E. Potok, Oak Ridge National Laboratory, USA
Danil Prokhorov, Toyota Research Institute NA, USA
Tapabrata Ray, University of New South Wales, Australia
Thomas Runkler, Siemens AG, Germany
Qiang Shen, Aberystwyth University, UK
Jennie Si, Arizona State Uniersity, USA
Joachim Sprave, Daimler AG, Germany
Ke Tang, University of Science and Technology of China, China
Hideyuki Takagi, Kyushu University, Japan
Chuan-Kang Ting, National Chung Cheng University, Taiwan
Vincenzo Loia, University of Salerno, Italy
Dianhui (Justin) Wang, La Trobe University, Australia
Slawo Wesolkowski, DRDC CORA, Canada
Feng (Fred) Xue, General Electric Global Research, USA
Ali M.S. Zalzala, Hikma Group Limited, UAE
Qi Zhang, Tama University, Japan
Yilu Zhang, General Motor Company, USA

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