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TSP 2020 : 2020 43rd International Conference on Telecommunications and Signal Processing (TSP) - IEEE R8 | IEEE Xplore® | SCOPUS

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Conference Series : Telecommunications and Signal Processing
 
Link: https://tsp.vutbr.cz/
 
When Jul 7, 2020 - Jul 9, 2020
Where Milan
Submission Deadline Feb 15, 2020
Notification Due Apr 15, 2020
Final Version Due Apr 30, 2020
Categories    computer science   signal processing   machine learning   security
 

Call For Papers

2020 43rd International Conference on Telecommunications and Signal Processing (TSP)
July 7-9, 2020, Milan, Italy
Web: http://tsp.vutbr.cz/

Special Session and Workshop Proposals: February 15, 2020
Full Paper Submissions: February 15, 2020

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Technical co-sponsors: IEEE Region 8 (Europe, Middle East and Africa), IEEE Italy Section, Italy Section SP Chapter, Italy Section VT/COM Joint Chapter,

IEEE Czechoslovakia Section, IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, and Scientific Association for Infocommunications, a Sister

Society of the IEEE and the IEEE Communications Society.

The TSP 2020 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library - IEEE

Conference Record #49548, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

After the conference, authors of about 25% highest rated papers will also be invited to submit the extended version for publishing in Special Journal Issues

(papers to be published after significant extension and new review process).
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GENERAL INFORMATION:

You are kindly invited to participate in the 2020 43rd International Conference on Telecommunications and Signal Processing (TSP - http://tsp.vutbr.cz/),

which will be held on July 7-9, 2020, in Milan, Italy.

The TSP Conference serves as a premier annual international forum to promote the exchange of the latest advances in telecommunication technology and

signal processing. The aim of the Conference is to bring together both novice and experienced scientists, developers, and specialists, to meet new

colleagues, collect new ideas, and establish new cooperation between research groups from universities, research centers, and private sectors from the

whole Europe, America, Asia, Australia, and Africa.

TOPICS:

TSP 2020 has opened Call for Workshop and Special Session Proposals (deadline set for January 15, 2020) and Call for Regular Full Paper Submissions

with a deadline February 15, 2020. We look forward to your innovative contributions in any of the following areas:

AREA 1: Telecommunications

1. Information Systems
2. Network Services
3. Network Technologies
4. Telecommunication Systems
5. Modelling, Simulation and Measurement

AREA 2: Signal Processing

6. Analog Signal Processing
7. Audio, Speech and Language Processing
8. Biomedical Signal Processing
9. Digital Signal Processing
10. Image and Video Signal Processing

For more details please visit the Conference website at http://tsp.vutbr.cz/?page_id=121 .

SPECIAL SESSIONS AND WORKSHOPS:

Prospective Organizers are invited to submit proposals for Workshops and Special Sessions held during the TSP 2020 Conference. Organizing guidelines

are available at http://tsp.vutbr.cz/?page_id=3492 .

The following Special Sessions will be organized during the Conference:

- WS1: 2nd International Workshop on Signal Processing Techniques for Ground Penetrating Radar Applications (SPT4GPRA) organized by Dr. Fabio Tosti,

PhD, Prof. Dr. Amir M. Alani, PhD (both University of West London (UWL), London, UK), Prof. Dr. Evert Slob, PhD (Delft University of Technology, Delft, The

Netherlands), and Dr. Francesco Soldovieri, PhD (National Research Council, Naples, Italy)
- SS1: Special Session on Multimodal Signal Processing and Classification organized by Prof. Dr. Corneliu Burileanu and Assoc. Prof. Dr. Anamaria Radoi

(both with the University Politehnica of Bucharest, Romania)

STUDENT BEST PAPER AWARD:

In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced

by the quality of papers, their presentations, and their technical excellence, the authors of the Best 5 Student Papers will be awarded during the conference

by the Technical Committee. The Best Student Paper Award consists in a Plaque and a Certificate of Appreciation.

The TSP 2020 is IEEE technically co-sponsored Conference organized in cooperation with eighteen universities:

- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
- Josip Juraj Strossmayer University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia
- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology in Bratislava, Institute of Multimedia Information and Communication Technologies, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataró, Mataró, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
- Université Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancée de Saint-Denis (LIASD), France
- University “Politehnica” of Bucharest, Center for Advanced Research on New Materials, Products and Innovative Processes (“CAMPUS”)
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland

COMMITTEES:

- Miloslav Filka, Brno University of Technology, Czech Republic – Full Professor, TSP Conference Founder - Honorary Chair
- Norbert Herencsar, Brno University of Technology, Czech Republic – IEEE Czechoslovakia Section CAS/COM/SP Joint Chapter Chair, IEEE Senior

Member - General Co-Chair
- Francesco Benedetto, University of “Roma TRE”, Italy – Full Professor, IEEE Senior Member - General Co-Chair
- Jiri Hosek, Brno University of Technology, Czech Republic – IEEE Member - Publications & Student Paper Contest Chair
- Aslihan Kartci, Brno University of Technology, Czech Republic – IEEE Member - Publicity & Social Media Chair
- Nandor Matrai, Asszisztencia Congress Bureau, Hungary – Finance Chair
- Csilla Fulop, Asszisztencia Congress Bureau, Hungary – Registrations Chair

Steering Committee:

- Larbi Boubchir, Universite Paris 8, France – Associate Professor, IEEE Senior Member
- Marcos Faundez-Zanuy, Escola Universitaria Politecnica de Mataro, Tecnocampus, Spain – Full Professor, Dean
- Izzet Cem Goknar, Isik University, Turkey – Institute of Science Director & Circuits and Systems (CAS) Society Turkey Chapter Chair, Full Professor, IEEE

Life Fellow
- Ray-Guang Cheng, National Taiwan University of Science and Technology (NTUST), Taiwan – Full Professor, IEEE Senior Member
- Ismail Kaya, Karadeniz Technical University, Turkey – Full Professor
- Jaroslav Koton, Brno University of Technology, Czech Republic – Vice-dean for Research, IEEE Senior Member
- Sridhar Krishnan, Ryerson University, Canada – Full Professor & Associate Dean, IEEE Senior Member
- Mario Kusek, University of Zagreb, Croatia – IEEE Croatia Section Communications Chapter Chair, IEEE Member
- Antonio Luque, University of Seville, Spain – IEEE Region 8 Vice Chair Member Activities 2017, IEEE Spain Section Chair 2016-2017, IEEE Senior

Member
- Shahram Minaei, Dogus University, Turkey – Full Professor, IEEE Senior Member
- Jiri Misurec, Brno University of Technology, Czech Republic – Full Professor, Department Chair
- Ram M. Narayanan, The Pennsylvania State University, USA – Full Professor, IEEE Fellow
- Kimio Oguchi, Seikei University, Japan – Full Professor, IEEE Senior Member
- Serdar Ozoguz, Istanbul Technical University, Turkey – Full Professor, Associate Chair
- Jakub Peksinski, West Pomeranian University of Technology, Poland
- Hector Perez-Meana, National Polytechnic Institute, Mexico – Full Professor, IEEE Senior Member
- Vladimir Poulkov, Technical University of Sofia, Bulgaria – Full Professor, Dean, IEEE Senior Member
- Costas Psychalinos, University of Patras, Greece – Full Professor, IEEE Senior Member
- Markus Rupp, Vienna University of Technology, Austria – Full Professor, Dean, IEEE Fellow
- Zdenek Smekal, Brno University of Technology, Czech Republic – Full Professor, IEEE Senior Member
- Attila Vidacs, Budapest University of Technology and Economics, Hungary – Deputy Head of Department
- Miroslav Voznak, VSB-Technical University of Ostrava, Czech Republic – Full Professor, Department Chair, IEEE Senior Member
- Drago Zagar, Josip Juraj Strossmayer University of Osijek, Croatia – Full Professor, Dean, IEEE Senior Member

IMPORTANT DATES:

- Deadline for Special Session and Workshop Proposals: January 15, 2020
- Full Paper Submissions: February 15, 2020
- Notification of Paper Acceptance: April 15, 2020
- Final Paper Submission: April 30, 2020
- Authors' Early Registration and Payment: May 10, 2020
- Authors' Late Registration and Payment: May 20, 2020
- Conference: July 7-9, 2020

CONTACTS:

Web: http://tsp.vutbr.cz/
E-mail: tsp@feec.vutbr.cz

Follow us on:
- Facebook https://www.facebook.com/tspconf/
- Twitter https://twitter.com/tspconf/

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TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the

paper is not presented at the Conference.
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