posted by user: FUN0524 || 2201 views || tracked by 2 users: [display]

ICANN--MSF, Ei, Scopus 2020 : MSF--2020 3rd International Conference on Advanced Nanomaterials and Nanodevices (ICANN 2020)--Ei Compendex, Scopus

FacebookTwitterLinkedInGoogle

Link: http://www.icannd.org
 
When Oct 16, 2020 - Oct 18, 2020
Where Fudan University, Shanghai, China
Submission Deadline Sep 10, 2020
Categories    materials science   industrial engineering   mechanical engineering   engineering
 

Call For Papers

MSF--2020 3rd International Conference on Advanced Nanomaterials and Nanodevices (ICANN 2020)--Ei Compendex, Scopus
Fudan University, Shanghai, China
October 16-18, 2020
http://www.icannd.org

With the success of 1st edition in Shanghai, China and the 2nd edition in Shanghai University, China. 2020 3rd International Conference on Advanced Nanomaterials and Nanodevices (ICANN 2020) will be held in Fudan University, Shanghai, China during October 16-18, 2020.
We welcome you to submit your paper to ICANN and share your research achievements with other conference participants at the the conference.

Topics:
Advanced Nanomaterials, Nanodevices for Nano engineering, recent advances in nanotechnology, covering fields from theory and experiment to applications of nanostructured materials and nanodevices in technology

Conference venue instruction:
Fudan University is a major public research university in Shanghai, China. It is widely considered as one of the most prestigious and selective universities in China.
Fudan is a member of the elite C9 League and a Chinese Ministry of Education Class A Double First Class University.
Fudan is renowned for its liberal atmosphere and rigorous academics. It is an important academic center for Chinese humanities, natural sciences, and medical studies.

Publication:
Submitted papers will be peer reviewed and accepted papers after proper registration and presentation will be published into Materials Science Forum (ISSN print 0255-5476 / ISSN web 1662-9752), which will be indexed by Ei Compendex, Scopus.
** Selected papers from the conference will be recommended to Chinese Chemical Letters (CCL) [ISSN 1001-8417] for possible publication. CCL Impact Factor: 3.84. Each paper will be reviewed according to the policy of the journal. (Note: Excellent papers will be recommended to CCL after the conference.)

Submission:
Submission Due: May 25, 2020
**The more information about submission, please check: http://www.icannd.org/sub.html

Submission method: http://confsys.iconf.org/submission/icann2020
For any queries, please send email to: icann@cbees.net

Speakers:
ICANN 2020 Speakers to be confirmed soon...please visit: http://www.icannd.org/speaker.html
In 2019, Prof. Chengzhong Yu from The University of Queensland, Australia, Prof. Yonghui Deng from Fudan University, China, Prof. Zhang Jiujun from Shanghai University, China and Prof. Jiaqiang Xu from Shanghai University, China made their excellent speeches at the conference.

Conference Schedule:
October 16, 2020 (Friday)---Participant registration
October 17, 2020 (Saturday)--- Keynote Speeches and Parallel Sessions
October 18, 2020 (Sunday)---One-day Visit (Optional & Extra Registration Required)

Sponsorship:
Your participation in the ICANN 2020 Sponsor Program will give you instant visibility to the diverse group of Advanced Nanomaterials and Nanodevices.
As part of most levels of sponsorship, you will be provided with exhibit space throughout the technical portion of the conference. This heightened visibility will provide an opportunity for one-on-one exchange with conference participants. ICANN 2020 is the premier venue to accomplish your goals.

You can visit : http://www.icannd.org/sponsor.html to find more details.

Contact us
--------------------
Ms. Violet Xie
Tel: +86-28-87577778 Working Time: Monday- Friday 9:30-18:00 (UTC/GMT+08:00)
E-mail: icann@cbees.net
Website´╝Üwww.icannd.org


Related Resources

IEEE SEAI--EI Compendex, Scopus 2022   2022 2nd IEEE International Conference on Software Engineering and Artificial Intelligence (SEAI 2022)--EI Compendex, Scopus
CoMSE 2022   2022 International Conference on Materials Science and Engineering (CoMSE 2022)
IEEE--ICCIA--EI, Scopus 2022   IEEE--2022 7th International Conference on Computational Intelligence and Applications (ICCIA 2022)--EI Compendex, Scopus
ICMEIM 2021   [Ei Compendex & SCOPUS] 2021 International Conference on Mechanical Engineering and Intelligent Manufacturing
BIOTC--EI Compendex, Scopus 2022   2022 4th Blockchain and Internet of Things Conference (BIOTC 2022)--EI Compendex, Scopus
CCISP-IEEE-EI/Scopus 2021   The 6th International Conference on Communication, Image and Signal Processing
IWIP--EI Compendex, Scopus 2022   2022 2nd International Workshop on Image Processing (IWIP 2022)--EI Compendex, Scopus
ICDEPI-SCOPUS 2022   5th International Conference on Design Engineering and Product Innovation (ICDEPI 2022)
IEEE MAPE--EI Compendex, Scopus 2022   2022 IEEE the 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (IEEE MAPE 2022)--EI Compendex, Scopus
IoTE 2021   2nd International Conference on Internet of Things & Embedded Systems