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HPC 2020 : High Performance Computing

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Conference Series : High Performance Computing
 
Link: https://www3.cs.stonybrook.edu/~hpc2020/
 
When May 19, 2020 - May 21, 2020
Where Fairfax, VA
Submission Deadline Jan 22, 2020
Notification Due Feb 17, 2020
Final Version Due Mar 4, 2020
Categories    simulation   high performance computing
 

Call For Papers

The 2020 Spring Simulation Conference will feature HPC 2020, devoted to the impact of large-scale and distributed computing and communications on simulations. Advances in novel and heterogeneous architectures, high-end computers, large data stores are ushering in a new era of high performance parallel and distributed simulations. Along with these new capabilities come new challenges in computing and system modeling. The goal of HPC 2019 is to encourage innovation in high performance computing and communication technologies and to promote synergistic advances in modeling methodologies and simulation. It will promote the exchange of ideas and information between universities, industry, supercomputing centers, and national laboratories about new developments in system modeling, high performance computing and communication, scientific computing as well as simulation.

* Topics of interest include but are not limited to:

- High performance computing for Big Data analytics
- GPU, accelerator and co-processor computing; multicore and many-core computing
- Exascale challenges
- Power and energy-aware computing
- Cloud, distributed, and grid computing
- High performance numerical methods and programming
- High performance system modeling and simulation
- Large scale visualization and data management
- Tools and environments for coupling parallel codes
- Reproducibility of application performance results

* Submission Guidelines

Original, high-quality technical papers are solicited for review, possible presentation and subsequent publication in the conference proceedings. Papers are max 12 pages long with single column format (see author’s kit at http://scs.org/authorskit). Papers must not have appeared before (or be pending) in a journal or conference with published proceedings, nor may they be under review or submitted to another forum during SpringSim’20 review process.
All submissions will be peer reviewed and feedback will be provided. Authors of papers accepted at symposiums and their tracks are expected to attend the conference, present their work to their peers, transfer copyright, and pay a conference registration fee at the time their camera-ready paper is submitted. Papers registered and presented will be included in the conference proceedings, archived in the ACM Digital Library, and indexed in DBLP and SCOPUS.
Please use the paper template available at http://scs.org/authorskit. The use of the template is essential to facilitate the proceedings compilation and submission to the ACM Digital Library.

* Important Dates

Paper Submission: January 22, 2020
Notification of Acceptance: February 17, 2020
Camera-ready Paper Submission: March 4, 2020

* Contact

General Chair: Dongyoon Lee, Stony Brook University, USA, dongyoon@cs.stonybrook.edu
General Vice-Chair: Shaikh Arifuzzaman, University of New Orleans, USA, smarifuz@uno.edu
Program Committee Chair: David Easterling, University of Dayton Research Institute, USA, david.easterling@udri.udayton.edu
Program Committee Vice-Chair: Evan Coleman, Naval Surface Warfare Center Dahlgren Division, USA, evan.coleman1@navy.mil

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HPCCT--ACM, EI, Scopus 2022   ACM--2022 6th High Performance Computing and Cluster Technologies Conference (HPCCT 2022)--EI Compendex, Scopus
HiPEAC 2023   HiPEAC 2023 : The 18th International Conference on High-Performance Embedded Architectures and Compilers
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