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MicDAT 2020 : 3rd International Conference on Microelectronic Devices and Technologies

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Link: http://www.micdat-conference.com/
 
When Jun 17, 2020 - Jun 19, 2020
Where Tenerife (Canary Islands), Spain
Abstract Registration Due May 5, 2020
Submission Deadline Mar 15, 2020
Notification Due Apr 15, 2020
Final Version Due May 15, 2020
Categories    microelectronics   microelectronic devices   microelectronic technologies   MEMS
 

Call For Papers

The conference is the third of a series of annual International Conferences on Microelectronic Devices and Technologies (MicDAT) held in Barcelona (Spain), 2018 and in Amsterdam (The Netherlands), 2019 organized by IFSA. The MicDAT' 2020 conference is intended to create awareness of the huge potential of modern microelectronic technologies and to improve understanding on the recent challenges in a wide range of applications. The many different technological bases for the fabrication of microelectronic devices, SoC, SiP, MEMS and NEMS will be outlined in this 3-day conference.

A number of recognized experts from both: academy and industry in the field of microelectronic design will be invited to give their view in selected application areas. Featuring strong participation of industry and academia, the MicDAT' 2020 conference will provide an excellent opportunity to exchange ideas and present latest advancements in these areas.

The aim of MicDAT series of conference is to provide an annual world forum for the presentation and discussion of recent advances in microelectronics, and bring together leading international researchers, engineers and practitioners interested on any of the microelectronics related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner. The conference is coordinated with the IFSA series of conferences, which deal with physics and engineering.

* Analog, digital, mixed, and RF circuits and related design methodologies
* Analog-to-Digital Converters (ADC)
* Voltage-to-Frequency Converts (VFC)
* Frequency-to-Digital Converters (FDC)
* Time-to-Digital Converters (TDC)
* Logic, architectural, and system level synthesisNonlinear circuits
* Microprocessors, microcontrollers and DSPs
* Testing, design for testability, built-in self-test
* Area, power, and thermal analysis and design
* Mixed-domain simulation and design
* Embedded systems, low-power designs
* VLSI systems circuit and design
* Non-von Neumann computing and related technologies and circuits
* Design and test of high complexity systems integration
* SoC, MPSoC, NoC, SIP, and NIP design and test
* Process technologies, CMOS, BJT, BiCMOS, GaAs
* 3-D integration design and analysis
* Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ,
MTJ, etc.
* Design for Manufacturability/Technology Optimization/Yield & Quality
* Microelectronics processing and materials
* Semiconductor processing
* Modern electronics materials
* Solid-state electronics
* Quantum electronics
* Thin solid films
* Nanoprocessing, nanotechnology and nanofabrication​
* Flexible and stretchable electronics​
* MEMS and NEMS
* CAD tools for microelectronics
* Hardware/software co-design
* Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
* Electronic materials science and technology
* Organic electronic materials and devices
* Microelectronics reliability and qualification
* Assembly and Packaging


Contribution Types:

* Keynote presentations and invited talks
* Industrial presentations
* Special Sessions presentations
* Regular papers
* Posters
* Exhibition


Special Sessions:

Authors are welcome to organize and manage special sessions during the conference. Each session will contain 4-6 papers in a related field as specified above.


Session organizers will get:

Certificate of Appreciation
Free Registration for the Event Special Publishing Theme within Conference Proceedings
Free article and book chapter post conference publications in appropriate open access journals and ‘Advances in Microelectronics: Reviews’, Book Series, Vol. 3

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