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EI/SCOPUS-ICDEPI 2020 : 4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)

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Link: http://www.icdepi.org/
 
When Jul 9, 2020 - Jul 11, 2020
Where Kuala Lumpur, Malaysia
Submission Deadline Mar 25, 2020
Categories    design   education   mechanical   engineering
 

Call For Papers

Call for Papers
4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020)
9-11, July, 2020/Kuala Lumpur, Malaysia
Web: http://www.icdepi.org/

4th International Conference on Design Engineering and Product Innovation (ICDEPI 2020) is co-organized by Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Kuala Lumpur, Malaysia from July 9 to 11, 2020!

The conference is an international forum for the presentation of technological advances and research results in the fields of design engineering and product innovation.

●Publication Information
All papers of ICDEPI 2020 will be published in Conference Proceeding , which will be indexed by EI Compendex, Scopus, Conference Proceedings Citation Index – Science (CPCI-S)(Thomson Reuters, Web of Science), Inspec and other databases for review and indexing.

●Invited Speaker (Continuous updating)
Prof. Dongming Wei, Nazarbayev University, Kazakhstan
Dongming Wei is a full Professor in the Department of Mathematics of Nazarbayev University. His research portfolio includes nonlinear finite element analysis of engineering problems in solid and fluid mechanics, modeling of graphene based structural materials, modeling of human eye and cancer cells, modeling of soil foundations and landslides, modeling of porous medium flows at high Reynolds numbers, computational non-Newtonian thermal flows in extrusion dies, numerical solutions of nonlinear option price equations.

Prof. Weimin Huang, Nanyang Technological University, Singapore
Dr Wei Min Huang is currently an Associate Professor at the School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore. He has 17 years of experience on shape memory materials (alloy, polymer, composite and hybrid) and technologies. He has published two books (Thin Film Shape Memory Alloys [co-ed., Cambridge University Press, 2009]; Polyurethane Shape Memory Polymer [co-au., CRC, 2011]) and over 100 papers in journals, such as Materials Today, Soft Matter, Journal of Materials Chemistry etc, and has been invited to review manuscripts from over 60 international journals and proposals from American Chemical Society etc. He is currently on the editorial board of four journals.


●Topics(for more topics: http://www.icdepi.org/cfp.html)
Design Engineering
Design Processes
Design Theory and Research Methodology
Design Education
Production Innovation
Product Development and Design
Product Process Design and Management
Product Quality Management

●Paper Submission
Submission Email: icdepi@smehk.org
Submission System: https://cmt3.research.microsoft.com/ICDEPI

●Call for participants
1,Presenter:If you are interested in giving presentation on conference, without publishing your paper in the proceeding, you need to submit the abstract and title of your presentation to us: icdepi@smehk.org
2,Listener: If you are interested in attending the conference to participant this gathering on the field of Design Engineering and Product Innovation you are welcome to join us and share your ideas!
3,Reviewer:Experts in the area of Design Engineering and Product Innovation are welcome to join the conference as reviewer. Send your CV to: icdepi@smehk.org

●Contact Us
Ms. Linda Lee
Email: icdepi@smehk.org
Tel:+852-30697937( Hong Kong)
Web: http://www.icdepi.org/

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