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ISSM 2010 : International Symposium on Semiconductor Manufacturing

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Link: http://www.semiconportal.com/issm/
 
When Oct 18, 2010 - Oct 20, 2010
Where Tokyo, Japan
Submission Deadline May 31, 2010
Notification Due Jul 16, 2010
Final Version Due Aug 31, 2010
Categories    semiconductor   manufacturing   semiconductor
 

Call For Papers

Since its start in 1992 in Japan, ISSM has provided unique opportunities to share semiconductor manufacturing technology "best practices" for the benefit of professionals worldwide. At the symposium, semiconductor manufacturing professionals gather together to seriously discuss presented technologies developed because of the world wide need for semiconductor manufacturing technology advancement. The 18th annual ISSM will be held in Tokyo, Japan.

It is crucial to re-examine semiconductor manufacturing in terms of fundamental principles in order to continue scaling beyond the 32nm/22nm nodes. In addition, manufacturing technologies for preserving the earth's environment have become new challenges.

These manufacturing technology challenges show the need for drastic revolutionary thought and stronger collaborative efforts to find solutions to the pre-competitive challenges.

The ISSM 2010 will feature keynote speeches by world leading speakers, timely and highlighted topics in addition to the ISSM areas of interests, and networking sessions focusing on equipment/materials/software/services with suppliers exhibits. ISSM contributes to the continued growth of the semiconductor industry through its infrastructure for networking, discussion, and information sharing among the world's professionals. We invite you to share your professional experiences at the Eighteenth International Symposium on Semiconductor Manufacturing.

Areas of Interest

Abstract will be accepted for each of following areas of interest. See reverse for further information.

Fab Management

* Factory Design & Automated Material Handling(FD)
* Manufacturing Strategy and Operation Management (MS)
* Manufacturing Control and Execution (MC)
* Environment, Safety and Health (ES)

Process Integration

* Process and Material Optimization (PO)
* Yield Enhancement Methodology (YE)
* Contamination Control and Ultraclean Technology (UC)
* Process Control and Monitoring (PC)
* Process and Metrology Equipment(PE)
* Design for Manufacturing (DM)

Final Manufacturing

* Final Manufacturing (FM)

Highlight Theme

Papers on the topics of special interests will be rearranged and will be programmed as a special session for highlight themes. Papers on the following topics are especially welcome. See reverse information.

* NGF: Next Generation Factory
* Lean Manufacturing
* Green Manufacturing
* Advanced Lithography Challenge in Production
* Ultra High Productivity
* TSV:Through Silicon Via
* Application Specific Semiconductor Manufacturing

Author Information

Prospective authors are requested to submit abstracts through web browser, consisting of exactly two pages - one page of text (approximately 3,000 characters) and a second page of supporting data, charts, photos and drawings. Only MS-WORD files using the provided template will be accepted. Abstract must be written in English.

Abstract Submission Start
Monday, April 12, 2010
Abstract Submission Due
Monday, May 31, 2010
Notification of Paper Acceptance
Friday, July 16, 2010

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