posted by organizer: CIMLAE || 694 views || tracked by 1 users: [display]

innoLAE 2020 : Innovations in Large-Area Electronics

FacebookTwitterLinkedInGoogle

Link: http://innolae.org
 
When Jan 21, 2020 - Jan 22, 2020
Where Cambridge, UK
Submission Deadline Sep 30, 2019
Notification Due Oct 31, 2019
Final Version Due Dec 31, 2019
Categories    printed electronics   flexible electronics   bioelectronics
 

Call For Papers

Large-Area Electronics (LAE) is a new way of making electronics and includes printed, flexible, plastic, organic and bio- electronics. LAE has the potential to both open up new markets for electronics and to expand existing products by adding new form factors, new functionality and enabling new cost structures. Applications abound in high growth industrial sectors such as healthcare and medical, sport and fitness, fast moving consumer goods, automotive, the Internet of Everything, printing and packaging and smart wearables. The new form factors and flexibility possible with LAE allow electronic systems to be deployed in a wide variety of non-traditional situations: in and on paper, plastic, textiles, furniture, cars and buildings, as well as on packaging and even in and on the human body.

innoLAE 2020 represents a unique opportunity to hear the latest developments from academic and industrial teams active in LAE research and technology, including keynotes and invited talks from leading international organisations.

Our sixth annual conference, innoLAE 2020 will be on January 21-22 2020 at the Wellcome Genome Campus, Cambridge, UK, presenting a varied 2-day programme featuring contributions from academia and industry, highlighting the most recent and exciting innovations in LAE and new products incorporating LAE technologies. innoLAE 2020 will offer both plenary and parallel track oral presentations, a poster session with prizes awarded to the most promising scientific and technical developments, an exhibition with leading companies and organizations showcasing their latest products and developments, and networking opportunities, including a reception and a conference gala dinner.

We invite contributions to the conference programme on topics relating to LAE such as:
1. Manufacturing LAE
• Addressing the challenges and opportunities of non-traditional substrates e.g. paper, plastics, metal, fabrics, living tissue
• Improved and novel processes for LAE manufacturing offering higher throughput, functionality, yield or lower cost
• Entirely new paradigms for LAE manufacturing
• Tackling the challenges of scale-up in LAE manufacturing, including metrology, yield, lean manufacture and design for manufacturing
• 3D printing of electronics
2. High-performance materials for LAE
including
• Organic semiconductors,
• Metal oxides,
• Graphene, 2D and layered materials,
• Perovskite materials
• Quantum dots,
• Novel conductors and dielectrics
• stretchable and biocompatible materials,
• biodegradable substrates, etc. (not including production technologies for materials)
3. Novel devices and systems for LAE
• OLEDs for display and lighting
• Transistors, diodes, sensors, detectors, etc.
• Energy harvesting and storage using LAE – (e.g. RF, piezo, thermal and solar harvesting, printable batteries and supercapacitors)
• Third generation PV – organic, perovskite, QD and other hybrids
• Circuit elements e.g. amplifiers, A-D converters, multiplexers, microprocessors etc.
• Circuits incorporating LAE including multi-element LAE device arrays
• Flexible displays – both emissive and reflective
4. LAE Technology Platforms
• Flexible hybrid electronics - integrating organic or printed electronics with thinned and unpackaged conventional semiconductor devices,
• E-textiles and wearable LAE
• Stretchable and conformable electronics
• Structural electronics
5. Applications of LAE
Including
• Internet of Things,
• Healthcare and medical,
• Automotive,
• Smart buildings
• Security applications
• Design of systems using LAE components for particular applications
• Application case studies of new LAE systems used in market trials
6. Bioelectronics: LAE devices and systems for bioelectronics; new applications of bioelectronics; new business models for bioelectronics
7. Sustainability of LAE: Sustainable materials; End-of-life management; waste reduction; recycling and reuse of LAE materials, components and systems; Opportunities for LAE to enable a sustainable economy

Related Resources

BIOS 2021   Biosensors 2020/2021: 31st Anniversary World Congress on Biosensors
EAI BODYNETS 2020   (Virtual) 15th EAI International Conference on Body Area Networks: Smart IoT and big data for intelligent health management
EI/SCOPUS-ICRESG 2021   6th International Conference on Renewable Energy and Smart Grid (ICRESG 2021)
4th ICSTR Rome 2021   4th ICSTR Rome – International Conference on Science & Technology Research, 09-10 September 2021
SECCE 2021   2021 International Symposium on Electronics, Communications and Control Engineering (SECCE 2021)
ICCED--IEEE, EI Compendex and Scopus 2021   IEEE--2021 4th International Conference on Consumer Electronics and Device (ICCED 2021)--Ei Compendex, Scopus
CODASPY 2021   The 11th ACM Conference on Data and Application Security and Privacy
ML4Music 2021   Special Issue: Machine Learning Applied to Music/Audio Signal Processing (Electronics)
Springer Digital Innovations Book 2021   Call for Book Chapters: Digital Innovations, Business and Society in Africa
MDPI-Electronics-Nanonets 2021   [MDPI Electronics] Special Issue on Nanonetworking Communications