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3DI 2010 : Call for Chapters: Depth Map and 3 D Imaging Applications:Algorithms and Technologies | |||||||||||||||
Link: http://old.igi-global.com/requests/details.asp?ID=846 | |||||||||||||||
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Call For Papers | |||||||||||||||
CALL FOR CHAPTER PROPOSALS--
Proposal Submission Deadline: May 25, 2010 Depth Map and 3 D Imaging Applications: Algorithms and Technologies A book edited by Aamir Saeed Malik, Tae‐Sun Choi and Humaira Nisar Universiti Teknologi Petronas (Malaysia), and Gwangju Institute of Science & Technology (Korea) To be published by IGI Global: http://www.igi-global.com/requests/details.asp?ID=846 Introduction With the advent of few 3D consumer electronics products in 2009, the importance of three dimensional(3D) imaging technology has increased significantly. 3D imaging systems offer a richer experience for the consumers and they are expected to replace the traditional systems. In 2010, the leading consumer electronics manufacturers are introducing 3D TVs, 3D cameras, 3D printers and 3D computers. Some of them are Panasonic, Samsung, LG, Sony, Olympus, Canon, JVC, Sharp, Hitachi,HP and Acer. Their technology is currently based on stereoscopic vision and displays. However, as the 3D technology matures over time, autoseteroscopic vision and displays will replace the stereoscopic technology. It can rightly be said that the next decade is the decade for 3D imaging technology. Objectives of the Book This book will aim to provide the relevant theoretical frameworks and the latest esearch findings in 3D imaging. It will cover algorithms and technologies for 3D Imaging as well as discuss their various applications. It will provide the current status of the technologies and will discuss the future trends too. Target Audience This book will be an important resource and reference for professionals, scientists, researchers,academics and software engineers in image/video processing and computer vision. It is a multidisciplinary field, so in addition to electrical and electronics engineering, it will also be of interest to those involved in material science, robotics, astronomy, terrain mapping, mechanical engineering and medical sciences. It will be a potential resource for post graduate and senior undergraduate students too. Recommended topics include, but are not limited to, the following: • 3D Capture: 3D ‐visual scene capture, multi‐view and multi‐sensor image capture, calibration and synchronization of multiple cameras, stereoscopic capture, and holographic capture. • 3D Processing: 3D ‐visual scene reconstruction techniques for static and dynamic scenes, 3D data processing, 3D tracking, depth estimation and view synthesis from multi‐view images/videos, and compact representation and compression of multi‐view images/ videos. • 3D Visualization & Displays: Stereoscopic, auto‐stereoscopic, and holographic display & projectors, 3D projectors, volumetric displays & projectors, head‐mounted 3D displays, 2D‐3D conversion of Images, and 3D representation tools: meshes, points, and voxels. • 3D Transmission: Source coding, channel coding, transmission, decoding and broadcasting of 3D/ multi‐view images/videos/data, 3D teleimmersion and remote collaboration. • 3D Applications: 3D television, free viewpoint TV systems, 3D cinema, 3D printing, educational 3D systems, guidance and advertizing systems, 3D imaging in virtual heritage and virtual archaeology, 3D games, 3D entertainment, 3D virtual studios, augmented reality and virtual environments, medical and biomedical applications, 3D content‐based retrieval and recognition, 3D watermarking, 3D computers and other applications. Submission Procedure Researchers and practitioners are invited to submit on or before April 15, 2010, a 2‐3 page chapter proposal clearly explaining the mission and concerns of his or her proposed chapter. Authors of accepted proposals will be notified before May 15, 2010 about the status of their proposals and sent chapter guidelines. Full chapters are expected to be submitted by September 1, 2010. All submitted chapters will be reviewed on a double‐blind review basis. Publisher This book is scheduled to be published by IGI Global (formerly Idea Group Inc.), publisher of the “Information Science Reference” (formerly Idea Group Reference), “Medical Information Science Reference,” “Business Science Reference,” and “Engineering Science Reference” imprints. For additional information regarding the publisher, please visit www.igi‐global.com. This publication is anticipated to be released in 2011. Important Dates April 15, 2010: Proposal Submission Deadline May 15, 2010: Notification of Acceptance September 1, 2010: Full Chapter Submission October 31, 2010: Review Results Returned November 30, 2010 Revised Chapter Submission December 15, 2010 Final Acceptance Notification January 15, 2011 Final Chapter Submission Editorial Advisory Board Members: Fabrice Meriaudeau, University of Bourgogne, France Naeem Azeemi, COMSATS Institute Information Technology, Pakistan Kishore Pochiraju, Stevens Institute of Technology, USA Martin Reczko, Biomedical Sciences Research Center "Alexander Fleming", Varkiza, Greece Iftikhar Ahmad, Nokia, Finland Nidal kamel, Universiti Teknologi Petronas, Malaysia Umer Zeeshan Ijaz, University of Cambridge, UK Asifullah Khan, Pakistan Institute of Engineering and Applied Sciences, Pakistan Inquiries and submissions can be forwarded electronically or by mail to: Aamir Saeed Malik, Ph.D. Department of Electrical and Electronics Engineering Universiti Teknologi Petronas Tel.: +605‐368‐7853 • Fax: +605‐365‐7443 • GSM: +60‐16‐553‐7853 E‐mail: aamir_saeed@petronas.com.my |
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