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INTERCON 2019 : IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing

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Link: http://www.intercon.org.pe
 
When Aug 12, 2019 - Aug 14, 2019
Where Lima, Peru
Submission Deadline May 15, 2019
Notification Due Jun 15, 2019
Final Version Due Jun 30, 2019
 

Call For Papers

The 2019 IEEE XXVI International Conference on Electronics, Electrical Engineering and Computing – INTERCON aims to bring together researchers, professionals, students and entrepreneurs to facilitate the approach, identification and commitment to join challenges that allow the development of technologies for the benefit of humanity.

2019 INTERCON will be held in Lima, Peru, the Gastronomic Capital of Latin America and World Heritage Site by UNESCO. Museums with great works of art, archaeological sites, beaches, the boardwalk, valleys, natural reserves, the nightlife, the thrill of adventure sports, and the exquisite cuisine gives Peru’s capital an authentic personality and makes tourism in Lima a unique experience in the country.

2019 INTERCON will be hosted at the Universidad Autonoma del Peru in Villa El Salvador, an urban, largely residential coastal district on the outskirts of Lima.

Topics of interest include but are not limited to:
Communication systems
Semiconductor and devices
Computers and information technology
Signal processing
Systems and control
Emerging technologies
Circuits and systems
Power generation, transmission and distribution
Renewable energy sources, smartgrids technologies and applications
Power electronics, systems and applications
Electrical machines and adjustable speed drives
High voltage engineering and insulation technology
Algorithms and complexity
Architecture and organization
Graphics and visualization
Information management, assurance and security
Intelligent systems
Parallel and distributed Computing
Software engineering
Social issues and professional practice

Submission
The official language of INTERCON is ENGLISH. The maximum number of authors per paper is four (4). Papers must be submmited in PDF and no longer than four (4) pages, following the IEEE Conference Template available at:
https://www.ieee.org/conferences/publishing/templates.html

We will use EasyChair system for submissions here:
https://easychair.org/conferences/?conf=2019ieeeintercon

Registration
Every accepted paper will need one associated full registration for being included in the conference technical program and proceedings.

Publication
As it is mandatory for any IEEE conference, we will implement a strict “No Show No Publication” policy, meaning that accepted papers that are not presented at the conference will not be submitted for publication in IEEE Xplore. Such presentations must be done on-site, so participants and authors can talk and interchange their experiences and views. Face-to-face technical discussions are a precious element of quality of our conference.
All the papers submitted through EasyChair will be peer reviewed and all of the accepted papers, if they are presented at 2019 INTERCON, will be submitted for publication in IEEE Xplore.

Important dates
Full paper submission deadline: May 15
Notification of acceptance: June 15
Final paper submission deadline: June 30
Conference dates: August 12-14

Organizing Committee
Conference Chair:
César Gallegos
cgallegos@ieee.org

Technical Program Chair:
Carlos Silva
csilva@pucp.edu.pe

Publication Chair:
Álvaro Talavera
ag.talaveral@up.edu.pe

Conference Treasurer:
Isaac Castillo
Isaac.castillo.la@ieee.org

Information Contact:
José Durán
joseduran@ieee.org

Sponsored by: IEEE Peru Section (www.ieee.org.pe)
Supported by: Universidad Autonoma del Peru IEEE Student Branch

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