Welcome to ICPMS2019
Welcome to 2019 International Conference on Physics and Materials Science (ICPMS2019), which will be held on June 16-17, 2019 in Shanghai International Convention Center (SHICC), China.
It is an annual research conference aims to provide a platform for the scientists, scholars, engineers and students from the Universities all around the world and the industry to present ongoing research activities. ICPMS 2019 will include the participation of renowned keynote speakers, oral presentations, posters sessions and technical conferences related to the topics dealt with in the Scientific Program. Contributions are expected from academia, industry, and management agencies. All honorable authors are kindly encouraged to contribute to and help to shape the conference through submissions of their research papers.
Publication & Indexing
Journal Name: DEStech Transactions on Materials Science and Engineering
ISSN Online: 2572-889X
Indexed by: EI Compendex, Scopus, CPCI-S (ISTP), Google Scholar, CNKI
All accepted papers will be published on the Journal of DEStech Transactions on Materials Science and Engineering with ISSN: 2572-889X, ISBN and DOI. The press (DEStech Publications) will submit all the papers to be indexed in EI Compendex, Scopus, Thomson Reuters Web of Science CPCI-S (ISTP) and CNKI Scholar for worldwide online citation.
Excellent papers will be selected and published on SCI or EI journals.
Giving oral/poster presentation on ICPMS2019 with publishing your paper in the proceedings. Please submit your papers to firstname.lastname@example.org.
Without submitting paper or giving presentation, you also can attend ICPMS2019 as Listener. Please email to email@example.com for more details.
As Keynote Speaker
We sincerely welcome experts to join the conference as TPC/Reviewer. If you are interested in, please send your latest CV and photo to firstname.lastname@example.org.
Without submitting paper or giving presentation, you also can attend ICPMS2019 as Listener. Please email to email@example.com for more details.