posted by system || 2421 views

WUN-SPIN 2010 : 3rd WUN International Conference on Spintronics Materials and Technology

FacebookTwitterLinkedInGoogle

Link: http://www.beckman.illinois.edu/wun-spin2010/index.aspx
 
When Jun 21, 2010 - Jun 23, 2010
Where Urbana, USA
Submission Deadline Apr 15, 2010
Notification Due May 17, 2010
Categories    spintronic materials
 

Call For Papers

3rd International Conference on Spintronics Materials and Technology • June 21 - 23, 2010

NSF MCC Summer School: "Green's Function and Other Electronic Structure Methods for Materials Property and Device Prediction" • June 24 - July 2, 2010

Beckman Institute at the University of Illinois • Urbana, IL

The 3rd WUN International Conference on “Spintronic Materials and Technology” (WUN-SPIN10) is a follow-up of the 1st (WUN-SPIN07, York, UK 2007) and the 2nd (WUN-SPIN08, Nanjing & Hangzhou 2008) conferences. This conference is intended to be a forum for experts to discuss the new scientific and technological developments in the field of spintronics.

As such, its emphasis will be placed on spintronic applications, and impact on technology. The list of topics included:

* Diluted magnetic semiconductors
* Novel magnetic and spintronic materials
* Organic Spintronics
* Spin injection and detection
* Spin generation and coherence
* Spin torque
* Spin dynamics and magnetic reversal
* Spintronic devices and TMR
* Nanomagnetic material characterization
* Single spin devices
* Spintronic device simulation

The conference will be followed by a Summer School on “Green's Function and Other Electronic-Structure Methods for Materials Property and Device Prediction” organized by the NSF-funded Materials Computation Center (MCC).
Organizers

Jean-Pierre Leburton
University of Illinois
Electrical and Computer Engineering
Beckman Institute for Advanced Science and Technology

Duane Johnson
University of Illinois
Materials Science and Engineering
Important Dates

REGISTRATION WILL OPEN IN LATE FEBRUARY, 2010
ABSTRACTS DUE: April 15
REGISTRATION DEADLINE: May 17

Related Resources

IEEE-Ei/Scopus-ACEPE 2024   2024 IEEE Asia Conference on Advances in Electrical and Power Engineering (ACEPE 2024) -Ei Compendex
Magnetismconnect 2025   International Connect on Magnetism and Magnetic Materials
FCSIT 2024   2024 3rd Eurasian Conference on Frontiers of Computer Science and Information Technology
ADMIT 2024   2024 3rd International Conference on Algorithms, Data Mining, and Information Technology (ADMIT 2024)
CoMSE 2024   2024 3rd Conference on Materials Science and Engineering (CoMSE 2024)
MAEM 2024   The 3rd International Conference on Mechanical Automation and Engineering Materials
JCRAI 2024   2024 4th International Joint Conference on Robotics and Artificial Intelligence
DSIT 2024   2024 7th International Conference on Data Science and Information Technology (DSIT 2024)
ITNG 2024   The 21st Int'l Conf. on Information Technology: New Generations ITNG 2024
ICoIV 2024   2024 International Conference on Intelligent Vehicles (ICoIV 2024)