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IEEE-iSES 2019 : 5th IEEE International Symposium on Smart Electronic Systems (Formerly iNIS)

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Link: http://www.ieee-ises.org/
 
When Dec 16, 2019 - Dec 18, 2019
Where Rourkela
Submission Deadline Aug 20, 2019
Notification Due Sep 30, 2019
Final Version Due Oct 15, 2019
Categories    internet of thing   reliable vlsi system   cyber physical systems   big data application
 

Call For Papers

CALL FOR PAPERS: IEEE iSES 2019 - EXTENDED DEADLINE: August 20, 2019
5th IEEE INTERNATIONAL SYMPOSIUM ON SMART ELECTRONIC SYSTEMS
December 16-18, 2019, Rourkela, India

The primary objective of IEEE-iSES (formerly IEEE-iNIS) is to provide a platform for both hardware and software researchers to interact under one umbrella for further development of smart electronic systems. Efficient and secure data sensing, storage, and processing play pivotal roles in current information age. The state-of-the-art smart electronic systems cater to the needs of efficient sensing, storage, and computing. At the same time, efficient algorithms and software used for faster analysis and retrieval of desired information are becoming increasingly important. Big data which are large, complex data sets, are now a part of the Internet world. Storing and processing needs of the enormous amount of structured and unstructured data are getting increasingly challenging. At the same time, Internet of Things (IoT) and cyber-physical systems (CPS) have been evolving with simultaneous development of hardware and software and span across everyday consumer electronics. The performance and efficiency of the present as well as the future generations of computing and information processing systems are largely dependent upon advances in both hardware and software. IEEE-iSES is a sponsored meeting of Technical Committee on VLSI, IEEE-CS (http://www.ieee-tcvlsi.org/) that endorses a league of successful meetings including ASAP, ISVLSI, and ARITH, are now presented as "Sister Conferences".

CONTRIBUTIONS ARE SOUGHT IN THE FOLLOWING AREAS :
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Nanoelectronic VLSI and Sensor Systems (NVS)
Energy-Efficient, Reliable VLSI Systems (ERS)
Hardware/Software for Internet of Things and Consumer Electronics (IoT)
Hardware for Secure Information Processing (SIP)
Hardware/Software Solutions for Big Data (SBD)
Cyber Physical Systems and Social Networks (CSN)

IEEE-iSES technical program will include both contributed papers and contributions from invited speakers. IEEE-iSES 2019 will have keynote addresses, special sessions, a student research forum, a research demo session, and expert panels.

PAPER SUBMISSION DEADLINES:
-----------------------------
Submission : August 20, 2019
Acceptance : September 30, 2019
Final Version: October 15, 2019


Authors are invited to submit original, unpublished manuscripts of 2- to 6-page length at:
https://edas.info/index.php?c=26378
Previously published papers or papers under review for other conferences/journals should not be submitted for consideration. Authors may prepare original work of maximum 6 pages with an 200-word abstract using double-column IEEE conference-format template:
http://www.ieee.org/conferences_events/conferences/publishing/templates.html
Manuscripts in PDF format with author information (optional) should be submitted using the link. IEEE-iSES proceedings will be published by IEEE-CS conference publications services (CPS).


Authors should submit their original unpublished work of maximum 6 pages using IEEE-CS double-column conference format-template.

Selected papers from IEEE-iSES 2019 program will be invited for submission to a special issue peer-reviewed journal.

Special Sessions and Panels (SSP): iSES 2019 will consider proposals for special sessions as well as panels. Special session and panel proposals/papers can be submitted to “Special Sessions and Panels” track at the online submission link.
The submission deadline is the same as specified for the regular paper submissions.
All accepted special session papers will be published in the conference proceedings.

Student Research Forum (SRF): iSES 2019 will host a student research forum. Authors should submit their original unpublished work of maximum 4 pages using IEEE-CS double-column conference format-template. Manuscripts in PDF format with author information (optional) should be submitted to the “Student Research Forum” track
at the online submission link. The submission deadline is the same as specified for the regular paper submissions. All the accepted student research symposium papers will be published in the conference proceedings.

Research Demo Session (RDS); iSES 2019 will host a research demo session. In the Research Demo Session (RDS), authors can present live demonstrations and hardware prototypes of their research papers and projects. The research demo submission can be between 1-page (extended abstract) to a maximum of 4-pages (short paper).

Award Information: Student Travel Awards and Best Paper Awards are available.


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ORGANIZING COMMITTEE:
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General Chairs:
-------------------
K. K. Mahapatra, NIT Rourkela, India
Srinivas Katkoori, University of South Florida, USA

Program Chairs:
------------------
Leonel Sousa, IST Lisbon, Portugal
Saket Srivastava, University of Lincoln, UK
Kailash Chandra Ray, IIT Patna, India

Publication Chairs:
-------------------
Karthikeyan Lingasubramanian, University of Alabama at Birmingham, USA
Prabha Sundaravadivel, University of Texas at Tyler, USA

Web Chair:
------------------
Dhruva Ghai, Oriental University, India

Publicity Chairs:
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Michael Hubner, BTU Cottbus, Germany
Sri Hari Rao, NIT Warangal, India
S. Bhat, NIT Surathkal, India
Lakshiminarayanan, NIT Tirchi, India
Atin Mukherjee, NIT Rourkela, India
Samit Ari, NIT Rourkela, India
Alak Majumdar, NIT Arunachal Pradesh, India

Local Arrangement Chair:
-------------------------
Ayas Kanta Swain, NIT Rourkela, India
Saugat Kar, NIT Rourkela, India
Manish Okade, NIT Rourkela, India

Special Session Chairs:
-------------------------
B. Deshmukh, VNIT Nagpur, India
M.B. Srinivas, BML Munjal University, India

Student Research Forum Chairs:
--------------------------------
Santanu Sarkar, NIT Rourkela, India
Vijaya Bhaduria, MNIT Allahabad, India
Prasanna Mishra, IIIT Allahabad, India

Research Demo Session Chair:
-------------------------------------
Himanshu Thapliyal, University of Kentucky

Finance Chair:
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D. Subudhi, NIT Rourkela, India
Garima Ghai, Oriental University, India

Registration Chair:
--------------------
M. Hiremath, NIT Rourkela, India
Jitendra Kumar Das, KIIT Bhubaneswar, India

Industry Liaison Chairs:
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D. P. Acharya, NIT Rourkela, India
B.D. Sahoo, NIT Rourkela, India
Yen-Cheng Kuan, National Chiao Tung University, Taiwan

Women in Engineering Chairs :
------------------------------
Sumam David, NIT Surathkal, India
Preethisudha Meher, NIT Arunachal Pradesh, India

Steering Committee Chair:
--------------------------
Saraju P. Mohanty, University of North Texas, USA

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Track Chairs:
--------------

NVS Track Chairs:
------------------
Aida Todri-Sanial, CNRS-LIRMM/University of Montpellier, France
P. K. Tiwari, IIT Patna, India

IoT Track Chairs:
-------------------
Edmond Nurellari, University of Lincoln
António Grilo, University of Lisbon

SIP Track Chairs:
------------------
Haffizur Rehaman, IIEST, Shibpur, Kolkata

ERS Track Chairs:
------------------
Karthikeyan, University of Alabama
Dr. Rishad Shafiq, Newcastle University

SBD Track Chairs:
------------------
Sushanta Chakraborty, IIEST, Shibpur, Kolkata
Deepak Puthal, University of Technology, Sydney, Australia

CSN Track Chairs:
-------------------
Sujay Deb, IIIT Delhi
Theocharis Theocharides, The University of Cyprus, Cyprus

------------------------------------
STEERING COMMITTEE:
------------------------------------
Saraju P. Mohanty, University of North Texas, USA, Chair
Dhruva Ghai, Oriental University, India, Vice Chair
Aida Todri-Sanial, CNRS-LIRMM, France
Jia Di, University of Arkansas, USA
Ashok Srivastava, Louisiana State University, USA
Kamala Kanta Mahapatra, NIT Rourkela, India
Hai (Helen) Li, Duke University, USA
Sudeep Pasricha, Colorado State University, USA
Himanshu Thapliyal, University of Kentucky, USA
Xin Li, Duke University, USA

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