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ICICM--Ei & Scopus 2019 : 2019 The 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)--Ei Compendex and Scopus

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Link: http://www.icicm.net/
 
When Oct 25, 2019 - Oct 27, 2019
Where Beijing, China
Submission Deadline Aug 30, 2019
Categories    circuits   systems engineering   embedded systems   electron devices
 

Call For Papers

★ICICM 2019--IEEE Xplore,Ei Compendex and Scopus★

2019 The 4th International Conference on Integrated Circuits and Microsystems (ICICM 2019)--Ei Compendex and Scopus
Time: October 25-27, 2019
Place: Beijing, China
http://www.icicm.net/


==Publication: Conference Proceeding
==Indexed by: IEEE Xplore,Ei Compendex, and Scopus*
==Submission email:icicm@young.ac.cn (Or you still can submit to the submission system on website)
==Find the tempalte with the link:http://www.icicm.net/Template.doc

★ICICM Committees★
★Advisory Chairs
Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA
Prof. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan

★Conference Chairs
Prof. Zhigong Wang, Southeast University, China
Prof. Li Qiang, University of Electronic Science and Technology of China, China

★Conference Co-Chair
Prof. Gene Eu Jan, National Taipei University, Taiwan

★Program Chairs
Prof. Fei Yuan, Ryerson University, Canada
Prof. Zhi-Jian Xie, North Carolina A&T State University, USA

★Steering Committee Chair
Prof. Huang Le Tian, University of Electronic Science and Technology of China, China

★Technical Committee
Prof. Bo Yan, University of Electronic Science & Technology of China, China
Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India
Prof. Xiaoxiao Wang, BeiHang University, China
Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China
Prof. Jinzhao Wu, Guangxi University for Nationalities, China
Prof. Shiwei Feng, Beijing University of Technology, China
Assoc. Prof. Wei Ni, Hefei University of Technology, China
Assoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, China
Assis. Prof. Li Jiang, Shanghai Jiao Tong University, China
Prof. Jinyan Wang, Peking University, China
Prof. Zhi-Jian Xie, NC A&T State University, USA
Prof. S. Ushakumari, College of Engineering Trivandrum, India
Prof. Lu Tang, Southeast University, China
Prof. Haizhi Song, University of Electronic Science and Technology of China, China
Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China
Prof. Shiwei Feng, Beijing University of Technology,China
For more members, please visite conference website: http://www.icicm.net/committee.html


★★History

Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3


Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0


Papers of ICICM2018 can be checked in IEEE Xplore now!
Electronic ISBN: 978-1-5386-8311-8 | USB ISBN: 978-1-5386-8310-1 | Print on Demand(PoD) ISBN: 978-1-5386-8312-5

★TOPICS
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

★Support
1, Technical Support from IEEE
2, Sponsored by University of Electronic Science and Technology of China and Southeast University, China

★Conference schedule
1) October 25, 2019—Conference Materials Collection
2) October 26, 2019—Keynote Speeches & papers Presentations
3) October 27, 2019—Peer-Reviewed Presentations

★Conference Contact
Ms Sissi Chan
Email: icicm@young.ac.cn
Tel: +86-28-87777577

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