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IWASI 2019 : 8th IEEE International Workshop on Advances in Sensors and Interfaces


When Jun 13, 2019 - Jun 14, 2019
Where Otranto (LE), Italy
Submission Deadline Apr 8, 2019
Notification Due Apr 29, 2019
Final Version Due May 15, 2019
Categories    electronics   biomedical/chemical   automotive/space   high energy physics

Call For Papers

Call For Papers
----- 8th IEEE International Workshop on Advances in Sensors and Interfaces -----
---------------------------------Call For Paper----------------------------------

Digital version available at:

The IEEE International Workshop on Advances in Sensors and Interfaces (IWASI) is a premier bi-annual workshop on sensors and sensor interfaces that for 16 years has presented advances and disruptive solutions in the fields of software, architecture, design, manufacturing and materials for sensors and integrated circuits.
The 8th edition of the IEEE IWASI focuses on modelling, analysis, design and development of embedded cyber-physical systems, sensors and actuators for personalized medicine and healthcare applications, machine learning for low power embedded systems and smart sensing applications, high-energy physics, chemical sensing, autonomous sensors and interfaces, hard- and software co-design for security and cryptography, cybersecurity, autonomous driving and security for airplanes and trains.

------- TOPICS ----------

Papers are solicited in – but are not limited to - the following topics:

*Sensors and actuators for personalized medicine and healthcare applications
*Brain Computer Interfaces: from algorithm to the implementation
*Novel systems, sensing and communication technologies for the IoT
*Energy efficient Internet of Things
*Networked sensors and actuators for the smart city
*Robotics and sensors for Industry 4.0
*Smart sensors and devices for Artificial Intelligence
*High-energy physics
*Hard- and software co-design for security and cryptography
*Ultra-low power communication and wake-up radio devices for sensor networks
*Biochemical sensors, labs on a chip, multi-electrode arrays and their interfaces
*Sensor interfaces: analog and digital sensor data processing architectures and ICs
*Localization techniques on low-power radio communication technologies
*Printed, flexible, biodegradable and biocompatible sensors and interfaces
*New materials and new technologies for sensors, including 1D and 2D materials
*Wearable and wireless sensor networks
*Label-Free sensors for biomedical and environmental monitoring

Accepted papers will be included in the workshop proceedings and available on


Papers must be submitted in PDF format following the IEEE template (max. size 2MB).
They must be double column and should not exceed six A4 pages with all illustrations and references included. Manuscript guidelines as well as instructions on how to submit electronically are available on the conference web site.

Paper submission deadline:

April 8, 2019 (strict deadline)
Author Notification: April 29, 2019
Final Paper Submission deadline: May 15, 2019

The complete workshop program will be published on the conference web site
in May 2019.

----- COMMITTEE -----

General Chair

* De Venuto, D. (Politecnico di Bari and INFN, Italy)

Steering Committee

* Cumming, D.R.S. (University of Glasgow, UK)
* Di Sciascio, E. (Politecnico di Bari, Italy)
* Gielen, G. (University of Leuven, Belgium)
* Makinwa, K. (Delft Univ. of Technology, The Netherlands)
* Rabaey, J. (University of California at Berkeley,US)
* Van Hoof, C. (IMEC Leuven, Belgium)

Program Committee:

* Benini, L. (Università di Bologna, Italy and ETHZ, Switzerland)
* Cantatore, E. (Eindhoven University of Technology, The Netherlands)
* Casier, H. (AMI Semiconductors, Belgium)
* D'Amico, S. (Università del Salento, Italy)
* De Cesare, G. (University of Rome "La Sapienza", Italy)
* De Palma, M. (INFN Bari, Italy)
* Dilillo, L. (LIRMM, France)
* Docchio, F. (University of Brescia, Italy)
* Falk T.H.( INRS-EMT, Canada)
* Farella, E. (FBK, Italy)
* Fummi, F. (University of Verona, Italy)
* Kayal, M. (EPFL Lausanne, Switzerland)
* Milor, L. (Georgia Inst. of Technology,US)
* Nappi, E. (INFN Bari, Italy)
* Ohletz, M.J.(IDT Europe, German)
* Ohta, J. (NAIST Takayama, Ikoma, Japan)
* Ozanyan, K.B. (Manchester University,UK)
* Popovici, E. (University of Cork, Ireland)
* Rufer, L. (University Grenoble-Alpes, France)
* Ruta, M. (Politecnico di Bari, Italy)
* Thewes, R. (TU Berlin, Germany)
* Torsi, L. (University of Bari, Italy)
* Vigna, B. (ST Microelectronics, Italy)
* Sansoni, G. (University of Brescia, Italy)

Local Committee:

* Annese, V.F. (The University of Glasgow, UK)
* D'Amico, S. (Università del Salento, Italy)
* De Palma, M. (INFN Bari, Italy)
* Magno, M. (ETHZ, Switzerland)
* Mezzina, G. (Politecnico di Bari, Italy)

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