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TechDebt 2019 : International Conference on Technical Debt


When May 26, 2019 - May 27, 2019
Where Montreal, Canada
Abstract Registration Due Jan 14, 2019
Submission Deadline Jan 21, 2019
Notification Due Mar 1, 2019
Categories    software engineering   technical debt   software metrics

Call For Papers

The Second International Conference on Technical Debt will be held in Montréal, Canada, on May 26–27, 2019, collocated with ICSE 2019.

Technical debt is a metaphor that software developers and managers increasingly use to communicate key trade-offs between time to market and quality issues.

While other software engineering disciplines—such as software sustainability, maintenance and evolution, refactoring, software quality, and empirical software engineering—have produced results relevant to managing technical debt, none of them alone suffice to model, manage, and communicate the different facets of the design trade-off problems involved in managing technical debt. Similarly, while many software engineering practices can be used to get ahead of technical debt, organizations struggle with managing technical debt routinely and strategically.

TechDebt 2019 aims to bring together leading software engineering researchers and practitioners to explore theoretical and practical techniques for managing technical debt and to share experiences, challenges, and best practices.

The conference addresses all topics related to technical debt, including

analysis and measurement of technical debt
techniques and tools for calculating technical debt principal and interest
understanding causes and effects of technical debt
visualization of technical debt
economic models for describing or reasoning about technical debt
the business case for technical debt management
relationship of technical debt to software evolution, maintenance, and aging
relationship of technical debt with other activities, such as testing or requirements engineering
relationship of technical debt to DevOps
relationship of technical debt to quality attributes (especially run-time)
technical debt management within software life-cycle management
beyond software—technical debt in systems engineering
technical debt within software ecosystems and product lines
technical debt in design and architecture
technical debt in software models
concrete practices and tools used to manage technical debt
education related to technical debt
We invite submissions of papers in any areas related to the theme and goal of the conference in the following three categories:

Research Papers: describing innovative and significant original research in the field (up to 10 pages)
Experience Papers: describing industrial experience, case studies, challenges, problems, and solutions (up to 10 pages)
Short Papers: position and future trend papers describing ongoing research or new results (up to 5 pages)
Submissions must be original and unpublished work. Each submitted paper will undergo a rigorous review process by three members of the program committee. Submissions must be submitted online via the TechDebtConf2019 EasyChair conference management system and conform to the ICSE formatting guidelines.

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