posted by user: FUN0524 || 3888 views || tracked by 5 users: [display]

ICFM--KEM, Ei, Scopus 2019 : KEM--2019 The International Conference on Functional Materials (ICFM 2019)--Ei Compendex, Scopus

FacebookTwitterLinkedInGoogle

Link: http://www.icfm.net/
 
When Sep 4, 2019 - Sep 6, 2019
Where Tohoku University, Japan
Submission Deadline Jul 15, 2019
Categories    materials science   nanotechnology   mechanical engineering   physics
 

Call For Papers

* Welcome to ICFM 2019 *-www.icfm.net

2019 The International Conference on Functional Materials (ICFM 2019), will be held in 【Tohoku University, Japan】 during 【September 4-6, 2019】.
The conference aims to provide a forum for many of the leading researchers, scientists and engineers from across the field of Functional Materials.
We welcome you to join us this year for a program that includes keynote speakers, oral presentations and poster sessions.
Hope you find ICFM fruitfully and memorably.

● Proceedings
The submitted full papers will be peer-reviewed, accepted and registered full papers will be published into Key Engineering Materials (ISSN: 1662-9795) published by TTP.
It will be sent for major indexing, such as 【EI Compendex, Scopus】

● Keynote Speakers
Prof. LU Li, National University of Singapore, Singapore
Prof. Shu Yin, Tohoku University, Japan
Prof. Jinshu Wang, Beijing University of Technology, China

● Invited Speaker
Prof. Jiangfeng Ni, Soochow University, China


● Topics
- Biomaterials
- Building materials
- Carbon based materials
- Ceramic
- Composites
- Earthquake materials and design
- Environmental friendly materials
- High strength alloys
- Intelligent materials systems
- Iron and steel
- Materials processing and handling
- Metallurgical science
- Metallurgical fundamentals and techniques
- Micro/Nano materials
- New functional materials
- New energy materials
- Non ferrous metal material
- Optical, Electronic, Magnetic materials
- Polymeric materials
- Processing technology for functional materials
- Smart and intelligent materials
- Thin films Mechanical behavior and fracture
- Tool testing and evaluation of materials

● Submission
http://www.easychair.org/conferences/?conf=icfm2019.

● Venue
Tohoku University, Japan
Address: Katahira 2-1-1, Sendai, Miyagi, Japan

● Contact
Ms. Frannie Lee
T: +86 1397 222222 4
E: icfm@academic.net

Related Resources

IEEE-Ei/Scopus-ACEPE 2024   2024 IEEE Asia Conference on Advances in Electrical and Power Engineering (ACEPE 2024) -Ei Compendex
CoMSE 2024   2024 3rd Conference on Materials Science and Engineering (CoMSE 2024)
IEEE-Ei/Scopus-SGGEA 2024   2024 Asia Conference on Smart Grid, Green Energy and Applications (SGGEA 2024) -EI Compendex
JCRAI 2024   2024 4th International Joint Conference on Robotics and Artificial Intelligence
SPIE-Ei/Scopus-CVCM 2024   2024 5th International Conference on Computer Vision, Communications and Multimedia (CVCM 2024) -EI Compendex
SOFTFM 2024   3rd International Conference on Software Engineering Advances and Formal Methods
SPIE-Ei/Scopus-ITNLP 2024   2024 4th International Conference on Information Technology and Natural Language Processing (ITNLP 2024) -EI Compendex
CST 2024   11th International Conference on Advances in Computer Science and Information Technology
SPIE-Ei/Scopus-CCRIS 2024   2024 5th International Conference on Control, Robotics and Intelligent System (CCRIS 2024) -EI Compendex
CLBD 2024   5th International Conference on Cloud and Big Data