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MicDAT 2019 : 2nd International Conference on Microelectronic Devices and Technologies

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Link: http://www.micdat-conference.com/
 
When May 22, 2019 - May 24, 2019
Where Amsterdam, The Netherlands
Abstract Registration Due Mar 15, 2019
Submission Deadline Feb 11, 2019
Notification Due Feb 28, 2019
Final Version Due Apr 10, 2019
Categories    microelectronics   microelectronic devices   microelectronic technologies
 

Call For Papers

The topics of interest include (but not limited):

* Analog, digital, mixed, and RF circuits and related design methodologies
* Analog-to-Digital Converters (ADC)
* Voltage-to-Frequency Converts (VFC)
* Frequency-to-Digital Converters (FDC)
* Time-to-Digital Converters (TDC)
* Logic, architectural, and system level synthesis
* Nonlinear circuits
* Microprocessors, microcontrollers and DSPs
* Testing, design for testability, built-in self-test
* Area, power, and thermal analysis and design
* Mixed-domain simulation and design
* Embedded systems, low-power designs
* VLSI systems circuit and design
* Non-von Neumann computing and related technologies and circuits
* Design and test of high complexity systems integration
* SoC, MPSoC, NoC, SIP, and NIP design and test
* Process technologies, CMOS, BJT, BiCMOS, GaAs
* 3-D integration design and analysis
* Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
* Design for Manufacturability/Technology Optimization/Yield & Quality
* Microelectronics processing and materials
* Semiconductor processing
* Modern electronics materials
* Solid-state electronics
* Quantum electronics
* Thin solid films
* Nanoprocessing, nanotechnology and nanofabrication​
* Flexible and stretchable electronics​
* MEMS and NEMS
* CAD tools for microelectronics
* Hardware/software co-design
* Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs
* Electronic materials science and technology
* Organic electronic materials and devices
* Microelectronics reliability and qualification
* Assembly and Packaging


Contribution Types:

• Keynote presentations
• Industrial presentations
• Regular papers
• Posters

Special Sessions:

Authors are welcome to organize and manage special sessions during the conference. Each session will contain 4-6 papers in a related field as specified above.

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