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SLIP 2010 : System-Level Interconnect Prediction

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Conference Series : System-Level Interconnect Prediction
 
Link: http://www.sliponline.org/
 
When Jun 13, 2010 - Jun 13, 2010
Where Anaheim
Abstract Registration Due Feb 26, 2010
Submission Deadline Mar 4, 2010
Notification Due Mar 26, 2010
Final Version Due Apr 9, 2010
Categories    interconnect design   computer-aided design
 

Call For Papers

The 2010 System Level Interconnect Prediction (SLIP) workshop will be co-located with the 47th IEEE/ACM Design Automation Conference on June 13, 2010 at the Anaheim Convention Center, Anaheim, CA. The general technical scope of the workshop is the design, analysis and prediction of intercommunication fabrics in electronic systems. The organizing committee invites original contributions to the workshop. These contributions include papers, tutorials, panels, and special sessions.

Representative technical topics include, but are not limited to:

1. Interconnect prediction at various IC design stages
2. Interconnect design challenges and system-level NoC design
3. Design and analysis of power and clock networks
4. Interconnect architecture of structural designs and FPGAs
5. Interconnect fabrics of many-core architectures
6. Design-for-manufacturing (DFM) techniques for interconnects.
7. High speed PCB interconnect design
8. Design and analysis of chip-package interfaces
9. Interconnect topologies of multiprocessor systems
10. Interconnect design and prediction of through-silicon vias (TSV) in 3D ICs
11. Emerging interconnect technologies, e.g., RF interconnects, photonic networks,
carbon-based interconnects, etc.
12. Synergies between chip intercommunication networks and networks arising in other
contexts such as social networks, system biology.

Workshop themes:

• Regular paper sessions
• Paper discussion panels
• Interactive poster sessions
• Panels on hot research topics
• Embedded tutorials

Authors are invited to electronically submit papers of up to 8 pages in ACM proceedings format by following the instructions at http://www.easychair.org/conferences/?conf=slip10. SLIP’10 reviewing is double blind. The proceedings of SLIP 2010 will be published by ACM Press. SLIP 2010 will be co-located with the 47th ACM/IEEE Design Automation Conference (http://www.dac.com). More details about SLIP 2010, including submission guidelines, travel funding sources, and travel information can be found online at: http://www.sliponline.org/

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