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DFSD 2019 : The First International Workshop on Distributed Fog Services Design

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Link: http://ewsn2019.thss.tsinghua.edu.cn/workshops/dfsd2019.html
 
When Feb 25, 2019 - Feb 27, 2019
Where Beijing, China
Submission Deadline Nov 1, 2018
Notification Due Nov 30, 2018
Final Version Due Dec 18, 2018
Categories    fog computing   edge computing   internet of things
 

Call For Papers

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DFSD 2019
The 1st Int. Workshop on Distributed Fog Services Design (DFSD)

Co-located with 6th Int. Conf. on Embedded Wireless Systems and Networks (EWSN 2019)

Feb. 25-27, 2019, Beijing, China
http://ewsn2019.thss.tsinghua.edu.cn/workshops/dfsd2019.html

CALL FOR SUBMISSIONS
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Smart spaces, such as smart cities, are proliferating into a massive scale, thereby, IoT data, services and applications are being pressed to move to the Cloud. IoT Cloud integration has been recently extended from the core of the network to the edge of the network (i.e., Fog Computing) to address better mobility support, location-awareness and low latency. Developing applications using cloud and fog computing resources introduces
many challenges with respect to programming, networking, and service abstraction and distribution. In particular, in large-scale IoT applications with massive number of services, the way to model, develop and distributed services at device-, fog-, and cloud-levels is a top priority design challenge in this area. Topics include but are not limited to:

- Fog computing distributed architectures and frameworks
- Programming models and abstractions for Fog
- Dynamic programming models for Fog
- Fog-level task and service modeling and distribution
- Large-scale deployments and Fog
- Distributed resource management models for Fog
- Cloud and Fog integration
- Middleware for Fog infrastructures
- Fog mobility
- Performance (low latency and scalability)
- Heterogeneity and Interoperability of Fog devices

*Organizers*
Amir Taherkordi, University of Oslo, Norway
Schahram Dustdar, TU Wien, Austria
Lin Wang, TU Darmstadt, Germany

*Important Dates*
Paper submissions: Oct. 20, 2018
Notification: Nov. 30, 2018
Camera ready: Dec. 18, 2018

*TPC members*
Boris Koldehofe, TU Darmstadt, Germany
Etienne Elie, Intel, USA
Bin Cheng, NEC Labs, Heidelberg, Germany
Frank Eliassen, University of Oslo, Norway
Shiqiang Wang, IBM T.J. Watson, USA
Giancarlo Fortino, University of Calabria, Italy
Sirajum Munir, Bosch Research and Technology Center, USA
Christos Tsigkanos, TU Wien, Austria
Frank Alexander Kraemer, NTNU, Norway
Stephane Delbruel, KU Leuven, Belgium
Sumi Helal, University of Florida, USA
Christian Becker, University of Mannheim, Germany
Amy Murphy, Bruno Kessler Foundation (FBK), Italy
Angelo Corsaro, ADLINK, France
Geir Horn, University of Oslo, Norway

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