ICUASA 2019 : 2019 2nd International Conference on Umanned Aerial Systems and Aerospace(ICUASA 2019)
Call For Papers
●2019 2nd International Conference on Umanned Aerial Systems and Aerospace(ICUASA 2019)- Ei Compendex & Scopus—Call for papers
March 21-24, 2019. ｜Shenzhen, China｜Website: www.icuasa.org
●ICUASA 2019 provides researchers and industry experts with one of the best platforms to meet and discuss groundbreaking research and innovations in the field of Umanned Aerial Systems and Aerospace.
International invited speakers are invited to present their state-of-the-art work on various aspects, which will highlight important and developing areas.
●Publication and Indexing
All accepted papers will be published in the digital conference proceedings which will be sent to be Indexed by all major citation databases such as Ei Compendex, SCOPUS, Google Scholar, Cambridge Scientific Abstracts (CSA), Inspec, SCImago Journal & Country Rank (SJR), EBSCO, CrossRef, Thomson Reuters (WoS), etc.
A selection of papers will be recommended to be published in international journals.
●Program Preview/ Program at a glance
March. 21, 2019: Registration + Icebreaker Reception
March. 22, 2019: Opening Ceremony+ KN Speech+ Technical Sessions
March. 23, 2019: Technical Sessions+ Half day tour/Lab tours
March. 24, 2019: One day tour
1. PDF version submit via CMT: https://cmt3.research.microsoft.com/ICUASA2019
2. Submit Via email directly to: email@example.com
Ms. Yedda Q.Ye
Call for papers(http://www.icuasa.org/cfp.html):
Levels of Safety
Biologically Inspired UAS
Micro- and Mini- UAS
Energy Efficient UAS
Path Planning and Navigation
Reliability of UAS
UAS Transportation Management (UTM)
Advanced manufacturing for space applications;
Aeroelasticity & structural dynamics;
Air transport operations;
Air transport systems;
Challenges to environment;
Education and training;
Environmental control & life support in space;
Guidance, navigation and control;
Mission design and space systems;
Remotely piloted aircraft systems (UAV);
Safety and security;
Structure design and materials;
Testing and sensors;
Thermal science and applications.