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SISPAD 2010 : International Conference on Simulation of Semiconductor Processes and Devices

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Link: http://sispad2010.arces.unibo.it
 
When Sep 6, 2010 - Sep 8, 2010
Where Bologna, Italy
Submission Deadline Apr 3, 2010
Notification Due May 17, 2010
Final Version Due Jun 20, 2010
Categories    simulation   semiconductor   electron devices
 

Call For Papers

The International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) provides an international forum for presentation of the leading-edge research and development results in the area of process and device simulation. SISPAD is held annually, with the location of the conference circulating among Asia, Europe, and the U.S., and is one of the longest running conferences devoted to technology computer-aided design (TCAD). In year 2010, the 15th SISPAD will be organized on September 6-8, 2010 in Bologna, Italy, by the ARCES Research Center of the University of Bologna, with the technical co-sponsorship of the IEEE Electron Devices Society (EDS).

SISPAD attracts approximately 200 participants from around the world. The conference has thus the right size to allow for attendees to foster relationships and to exchange new ideas among their peers. SISPAD will have outstanding invited speakers who are going to present new results on the physics and technology of semiconductor processes and devices, demonstrate applications to leading edge technologies, and show new compact models for circuit simulation.

The location of SISPAD 2010 will be the Royal Carlton Hotel in Bologna. The social program features a welcome party, a concert and a gala dinner. Also, and an accompanying-person program will be organized with sightseeing tours in town and to Ravenna.

IMPORTANT DATES:

Deadline for abstract submission: April 3, 2010
Notification of acceptance: May 17, 2010
Final paper submission: June 20, 2010
Conference: September 6-8, 2010
Workshops: September 9, 2010

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