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MIXDES 2010 : 17th International Conference on Mixed Design of Integrated Circuits and Systems


When Jun 24, 2010 - Jun 26, 2010
Where Wroclaw, Poland
Submission Deadline Feb 28, 2010
Notification Due Apr 19, 2010
Final Version Due May 15, 2010
Categories    circuits   integrated circuits

Call For Papers

The MIXDES conference series started in Debe near Warsaw in 1994 and has been organized yearly in different Polish cities. This year we would like to continue the tradition of inviting you to the most attractive places in Poland and the will take place in Wrocław.
The aim of the MIXDES conference is to provide an annual Central-European forum for the presentation and discussion of recent advances in design, modeling, simulation, testing and manufacturing in various areas such as micro- and nanoelectronics, semiconductors, sensors, actuators and power devices.

The MIXDES conference papers are indexed in Thomson Reuters Conference Proceedings Citation Index and available in IEEE Xplore since MIXDES 2005.

The topics of the MIXDES 2010 Conference include:

1. Design of Integrated Circuits and Microsystems
Design methodologies. Digital and analog synthesis. Hardware-software codesign. Reconfigurable hardware. Hardware description languages. Intellectual property-based design. Design reuse.

2. Thermal Issues in Microelectronics
Thermal and electro-thermal modelling, simulation methods and tools. Thermal mapping. Thermal protection circuits.

3. Analysis and Modelling of ICs and Microsystems
Simulation methods and algorithms. Behavioural modelling with VHDL-AMS and other advanced modelling languages. Microsystems modelling. Model reduction. Parameter identification.

4. Microelectronics Technology and Packaging
New microelectronic technologies. Packaging. Sensors and actuators.

5. Testing and Reliability
Design for testability and manufacturability. Measurement instruments and techniques.

6. Power Electronics
Design, manufacturing, and simulation of power semiconductor devices. Hybrid and monolithic Smart Power circuits. Power integration.

7. Signal Processing
Digital and analogue filters, telecommunication circuits. Neural networks. Artificial intelligence. Fuzzy logic. Low voltage and low power solutions.

8. Embedded Systems
Design, verification and applications.

9. Medical Applications
Medical and biotechnology applications. Thermography in medicine.

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