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ICEED 2018 : 2018 IEEE 10th International Conference on Engineering Education

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Link: http://enter.uitm.edu.my/iceed2018/
 
When Nov 8, 2018 - Nov 9, 2018
Where Kuala Lumpur, Malaysia
Submission Deadline Aug 15, 2018
Notification Due Sep 1, 2018
Final Version Due Sep 30, 2018
Categories    engineering education
 

Call For Papers

It is again our great pleasure to announce the 2018 IEEE 10th International Conference on Engineering Education (ICEED2018) to be held in Kuala Lumpur, Malaysia from 8th-9th November 2018. ICEED 2018 will be organized by IEEE Malaysia Education Society and co-organized by Engineering and Technical Research Group (EnTER), Faculty of Electrical Engineering, University Teknologi MARA, Malaysia.

The proceedings of ICEED 2018 may be eligible for inclusion in the IEEE Xplore® Digital Library, once they meet the requirements of an IEEE quality review and indexing in SCOPUS.

Authors are invited to submit full papers describing original research. Areas of interest includes, but are not limited to the following tracks:

Accreditation and evaluation
Engineering Education Reforms
International Recognition of Qualifications
New Technologies in Engineering Education
Industry and Education Collaboration
Globalisation in Education
Women in Engineering Education
Changes and Challenges in Engineering Education
Computer and Web based software
Distance learning: methods, technologies, and assessment
Outcome Based Education
Linking Academic Knowledge with the Industrial Needs
Research and development in Engineering Education
Quality Assurance in Engineering Education
Education in Applied Sciences
Education in Social Sciences
Education in Life Science


Important Dates:

Submission of full paper : 15th August 2018
Notification of acceptance : 1st September 2018
Early Bird Registration : 15th September 2018
Final paper submission : 30th Sept 2018


Submission Format :

Please submit full papers to the Conference website address http://edas.info/N24650. Authors must not indicate their names and affiliations in the body of the paper submitted.

Further information can be obtained from the following website: http://enter.uitm.edu.my/iceed2018/

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