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IEEE TENCON 2018 : 2018 IEEE Region 10 Conference

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Link: http://www.tencon2018.org/
 
When Oct 28, 2018 - Oct 31, 2018
Where Jeju Island, Korea
Submission Deadline May 21, 2018
Notification Due Jul 23, 2018
Final Version Due Aug 27, 2018
Categories    electrical engineering   electronics   computer engineering   information technology
 

Call For Papers

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IEEE TENCON 2018
- 2018 IEEE Region 10 Conference -

October 28 – 31, 2018
Jeju Island, Korea
http://www.tencon2018.org/
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INTRODUCTION

The 2018 IEEE Region 10 Conference (IEEE TENCON 2018) will be held in Jeju Island, Korea, from October 28 to 31, 2018. TENCON is a premier international technical conference of IEEE Region 10, which comprises 58 Sections, 6 councils, 26 subsections, 663 chapters, and 1,431 student branches in the Asia Pacific region. The theme for TENCON 2018 is Intelligence Outbreak; researchers and engineers will be brought together from academia and industry, and they will freely expose their ideas and opinions on emerging issues in the field of electrical, electronics and computer engineering as well as information technologies.

SCOPE

The scope of the conference includes but not limited to the following areas:

(Topics for regular sessions)
* Antenna and Microwave
* Biomedical Engineering
* Circuits and Systems
* Communications and Networks
* Computational Intelligence
* Computer Systems
* Computing Technologies
* Devices, Materials and Processing
* Emerging Technologies
* Internet of Things
* Power and Energy
* Robotics and Control Systems
* Sensor Technologies and Applications
* Signal and Image Processing

(Topics for special sessions)
* 5G and Beyond
* Applications of Machine Learning in Science and Engineering
* Communications Security
* Edge Computing
* Humanitarian Technologies
* Microwave Technologies for Sensing and Communications
* Nanostructured Semiconductors and Their Applications
* Oxide Semiconductor Based Electronic Devices
* Quantum Communications
* Smart Wearable Technologies for Healthcare, Virtual Reality, Mobile Devices and Safety

PAPER SUBMISSION

Prospective authors are invited to submit full paper with four to six pages in double-column IEEE conference format via the conference website http:// www.tencon2018.org. More information about paper format and guidelines for paper submission can be found at the conference website.

PAPER PUBLICATION

The conference proceedings will be submitted to the IEEE Xplore digital library. In addition, extended versions of selected papers will be considered for publication in journals indexed in SCI, SCI-E and Scopus. For detailed information about the indexed journals, please, refer to the conference website.


IMPORTANT DATES

Paper submission: May 21, 2018
Notification of acceptance: July 23, 2018
Final manuscript submission: August 27, 2018

IEEE TENCON 2018 General Chairs
Changhyun Kim, POSTECH, Korea
Jong Chang Yi, Hongik University, Korea

IEEE TENCON 2018 TPC Chair
Cheon Won Choi, Dankook University, Korea

For further information, please contact: tencon2018@tencon2018.org.

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