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IEEE--ICICM--EI and Scopus 2018 : IEEE--2018 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)--Ei Compendex and Scopus

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Link: http://www.icicm.net/
 
When Nov 24, 2018 - Nov 26, 2018
Where Shanghai,China
Submission Deadline Sep 30, 2018
Categories    systems engineering   nanotechnology   networking   electronics
 

Call For Papers

IEEE--2018 The 3rd International Conference on Integrated Circuits and Microsystems (ICICM 2018)--Ei Compendex and Scopus

★IEEE ICICM2018--IEEE Xplore, Ei Compendex, and Scopus★

2018 The 3rd International Conference on Integrated Circuits and Microsystems
Time: November 24-26, 2018
Place: Shanghai,China
http://www.icicm.net/

==Publication: IEEE Conference Proceeding
==Indexed by: IEEE Xplore, Ei Compendex, and Scopus*
==Submission email:icicm@young.ac.cn (Or you still can submit to the submission system on website)
==Find the tempalte with the link:http://www.icicm.net/Template.doc

★Keynote Speakers & Invited Speakers
Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA
Prof. Gene Eu (Ching Yuh) Jan,National Taipei University, Taiwan
Prof. Fei Yuan,Ryerson University,Canada
Prof. Zhi-Jian Xie,North Carolina A&T State University, USA

★Advisory Chairs
Prof. Degang James Chen, IEEE Fellow, Iowa State University, USA
Prof. Meng-Fan (Marvin) CHANG, National Tsing Hua University (NTHU), Taiwan

★Conference Chairs
Prof. Zhigong Wang, Southeast University, China
Prof. Li Qiang, University of Electronic Science and Technology of China, China

★Conference Co-Chair
Prof. Gene Eu Jan, National Taipei University, Taiwan

★Program Chairs
Prof. Fei Yuan, Ryerson University, Canada
Prof. Zhi-Jian Xie, North Carolina A&T State University, USA

★Steering Committee Chair
Prof. Huang Le Tian, University of Electronic Science and Technology of China, China

★Technical Committee
Prof. Bo Yan, University of Electronic Science & Technology of China, China
Prof. Dr. Ashutosh Kumar Singh, National Institute of Technology, Kurukshetra, India
Prof. Xiaoxiao Wang, BeiHang University, China
Prof. Changchun Zhang, Shanghai University of Posts and Telecommunication / Southeast University, China
Prof. Jinzhao Wu, Guangxi University for Nationalities, China
Prof. Shiwei Feng, Beijing University of Technology, China
Assoc. Prof. Wei Ni, Hefei University of Technology, China
Assoc. Prof. Xingyuan Tong, Xi'an University of Posts & Telecommunications, China
Assis. Prof. Li Jiang, Shanghai Jiao Tong University, China
Prof. Jinyan Wang, Peking University, China
Prof. Zhi-Jian Xie, NC A&T State University, USA
Prof. S. Ushakumari, College of Engineering Trivandrum, India
Prof. Lu Tang, Southeast University, China
Prof. Haizhi Song, University of Electronic Science and Technology of China, China
Prof. Tang Bin, Chengdu Aeronautic Polytechnic, The Innovation Base of School-Enterprise Cooperation Aviation Electronic Technology in Sichuan, China
Prof. Shiwei Feng, Beijing University of Technology,China
For more members, please visite conference website: http://www.icicm.net/committee.html


★★History

Papers of ICICM2016 can be checked in IEEE Xplore and indexed by Ei Compendex and Scopus!
Electronic ISBN: 978-1-5090-2814-6 | Print ISBN: 978-1-5090-2813-9 | Print on Demand(PoD) ISBN: 978-1-5090-2815-3


Papers of ICICM2017 can be checked in IEEE Xplore now!
Electronic ISBN: 978-1-5386-3506-3 | Print ISBN: 978-1-5386-3505-6 | DVD ISBN: 978-1-5386-3504-9 | Print on Demand(PoD) ISBN: 978-1-5386-3507-0



★TOPICS
Digital, Analog, Mixed Signal IC and SOC design technology
Silicon integrated circuits and manufacturing
Low-power, RF devices & circuits
IC Computer-Aided –Design technology, DFM
Silicon/germanium devices and device physics
Interconnect, Low K, High K and other process technologies
Unconventional and nano-electronics
Organic semiconductor devices and technologies
Compound semiconductor devices and circuits
Displays, sensors and MEMS
Semiconductor materials and material characterization
Packaging and testing technology
Solar cell & other devices for new energy sources
Modeling and simulation
Equipment technology
Reliability
Displays, sensors and MEMS
Advance memories technology (Flash, FeRAM, PCM,ReRAM, MRAM etc.)

★Support
1, Technical Support from IEEE
2, support from University of Electronic Science and Technology of China and Southeast University, China

★Conference schedule
1) Nov. 24, 2018—Conference Materials Collection
2) Nov. 25, 2018—Keynote Speeches & papers Presentations
3) Nov. 26, 2018—Peer-Reviewed Presentations

★Conference Contact
?Ms Sissi Chan
Email: icicm@young.ac.cn
Tel: +86-28-87777577

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