posted by user: corina || 4614 views || tracked by 4 users: [display]

ISETC 2018 : 13th International Symposium on Electronics and Telecommunications - IEEE Romania Section


When Nov 8, 2018 - Nov 9, 2018
Where Timisoara, Romania
Submission Deadline Jun 25, 2018
Notification Due Jul 10, 2018
Final Version Due Oct 1, 2018
Categories    signal processing   telecomunications   electronics   image processing

Call For Papers

1-extension of submission deadline - June 25
2-topic of invited talk for Dr Alin Achim (Inverse Problems in Computational Ultrasound Imaging)
Politehnica University of Timisoara has the pleasure to announce the 13th edition of the International Symposium on Electronics and Telecommunications ISETC 2018, 8-9 Nov 2018, Timisoara, Romania,
*Conference #44100, technical co-sponsors IEEE Romania section and SP/IT/COM Joint Chapter, Romanian Academy of Technical Sciences.
*Papers presented at ISETC 2018 will be sent for inclusion in IEEE Xplore and ISI Web of Knowledge
*Previous four editions are indexed in IEEE Xplore, ISI Web of Knowledge and SCOPUS.
Invited speaker
Dr. Alin Achim, University of Bristol, UK
topic: Inverse Problems in Computational Ultrasound Imaging
Authors from academia and industry are invited to submit contributions from the following areas:
➔ Signal Processing
• Adaptive and Non-linear Signal Processing
• Digital Signal Processing
• Image Processing
• Statistical Signal Processing
• Signal analysis, Transform, and Reconstruction
• Speech and Audio Signal Processing
• Biomedical Signal and Image Processing
• RADAR Signal Processing
• Video Processing
• 3D Signal Processing
• Watermarking

➔ Telecommunications
• Information and Coding Theory
• Security
• Microwaves
• Antenna and Propagation
• Electromagnetic Compatibility
• Mobile Communications
• 3G, 4G and 5G Communication Networks
• Software for Telecommunications
• Artificial Intelligence and Machine Learning in Communications
• Network Simulation and Measurement Techniques
• Cloud Computing
• Wireless Applications
• Multimedia

➔ Intelligent Electronic Systems
• Artificial Intelligence
• Machine Learning and Deep Learning
• Neural Networks and Fuzzy Systems
• Human Computer Interaction
• Pattern Recognition, Biometrics and Affective Computing
• Robotics
• Embedded Systems
• Instrumentation and Measurement
• Circuits and Systems
• Power Electronics, Drives and Power Quality
• Intelligent Control
• Renewable Energy and Smart Grids
• Computer Aided Design
• Biomedical Electronics
• Modelling, Simulation and Testing
• Automotive

➔ Education & Learning Technologies
• Trends in Technical Education
• STEM in Education
• Curriculum Design and Development
• Teachers’ and Students’ Experiences
• Bologna Declaration and ECTS Experiences in HE
• Educational Management
• Learning technologies
• Flipped Learning
• Open Education and OERs
• Problem Based Learning
• Game Based Learning
• Design Thinking and Creativity
• Open Science and Research

Important deadlines

-Papers submission: June 25 (extended). Submit paper here:
-Notification of acceptance: July 10
-Submission of camera-ready papers: October 1

Related Resources

IEEE TETC-ETTRML 2021   Special Section on “To Be Safe and Dependable in the Era of Artificial Intelligence: Emerging Techniques for Trusted and Reliable Machine Learning”
IJAD 2021   International Journal of Advanced Dermatology
ICECE--IEEE, Ei and Scopus 2021   IEEE--2021 the 4th International Conference on Electronics and Communication Engineering (ICECE 2021)--Scopus, Ei Compendex
CST 2021   8th International Conference on Foundations of Computer Science & Technology
UPCON 2021   8th IEEE Uttar Pradesh Section International Conference on Electrical, Electronics and Computer Engineering (UPCON 2021)
SIGPRO 2021   International Conference on Data Science and Cloud Computing
EICC 2021   European Interdisciplinary Cybersecurity Conference (EICC 2021)
CBW 2021   2nd International Conference on Cloud, Big Data and Web Services
IEEE SSCI 2021   2021 IEEE Symposium Series on Computational Intelligence
ANTJ 2021   Advanced Nanoscience and Technology: An International Journal