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Face & Emotion Recognition - TSP 2018 : Robust Face and Emotion Recognition and Analysis Special Session on TSP 2018 | IEEE R8 | IEEE Xplore® | SCOPUS


When Jul 4, 2018 - Jul 6, 2018
Where Athens, Greece
Submission Deadline Mar 5, 2018
Notification Due Apr 15, 2018
Final Version Due Apr 30, 2018
Categories    face recognition   emotion recognition   classification   biometrics

Call For Papers

*** Special Session on Robust Face and Emotion Recognition and Analysis ***
*** ***

2018 41st International Conference on Telecommunications and Signal Processing (TSP)
July 4-6, 2018, Athens, Greece

Full Paper Submission: March 5, 2018 (extended deadline)

Technically co-sponsored by IEEE Region 8 (Europe, Middle East and Africa), IEEE Greece Section, IEEE Czechoslovakia Section, and IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter.

The TSP 2018 Proceedings, containing presented papers at the Conference, will be submitted for indexing to the IEEE Xplore® Digital Library registered under IEEE Conference Record #43564, SCOPUS, Conference Proceedings Citation Index (CPCI) of Thomson Reuters, DBLP, and Google Scholar databases.

Authors of the best rated and presented papers will be invited for publishing in special issues of international journals.


Image and face recognition is fast becoming a familiar feature in apps and on websites, potentially making life easier for all of us. Many applications and fields are targeted by robust recognition such as security, access control, social media, etc. Conventional techniques are improved or combined with intelligent tools to overcome constraints of face position, hidden or environment conditions related to luminosity, noise and other. As an extension to this field, emotion recognition and analysis has been extensively researched in neuroscience, psychology, cognitive science and computer science. Combined with face recognition, these two fields become necessary for many new industrial and applications. Within the framework of the 2018 41st International Conference on Telecommunications and Signal Processing (TSP) held during July 4-6, 2018 in Athens, Greece, we invite you to present and discuss advances in the research and development face recognition and emotion detection. Topics of interest include, but are not limited to, the following:

- Face identification and recognition
- Biometrics & Authentication
- Video tracking
- Robust identification of hidden and truncated faces
- Bio-medical & Cognitive Science
- Human Action Analysis
- Gesture recognition
- Perception, Cognition and Psychophysiology of Gesture Interaction
- Kinect-based Kinematic Data Analysis and Evaluation for Clinical Applications
- Generalized Face Spoofing Detection in Real-World Applications
- Automatic Kinship Verification from Face
- Emotion identifying and classification

For more details please visit the Conference website at .


- Ing. Dr. HDR. Hassene seddik — ENSIT, Tunisia (E-mail:
- Dr. Zied Lachiri — ENIT, Tunisia
- Assoc. Prof. Nawres Khlifa — ISTMT, Tunisia


In cooperation with IEEE Czechoslovakia Section SP/CAS/COM Joint Chapter, to recognize outstanding technical contributions by students, as evidenced by the quality of papers, their presentations, and their technical excellence, the authors of the Best 3 Student Papers will be awarded during the conference by the Technical Committee. The Best Student Paper Award consists in a Certificate of Appreciation Plaque and an IEEE Student or IEEE Graduate Student membership for 2019.


The TSP 2018 is IEEE technically co-sponsored Conference organized in cooperation with seventeen universities:

- Brno University of Technology, Department of Telecommunications, Brno, Czech Republic
- Budapest University of Technology and Economics, Department of Telecommunications and Media Informatics, Budapest, Hungary
- Czech Technical University in Prague, Department of Telecommunication Engineering, Prague, Czech Republic
- Isik University, Department of Electrical and Electronics Engineering, Sile/Istanbul, Turkey
- Istanbul Technical University, Electronics and Communication Engineering Department, Istanbul, Turkey
- Karadeniz Technical University, Department of Electrical and Electronics Engineering, Trabzon, Turkey
- National Taiwan University of Science and Technology, Department of Electronic and Computer Engineering, Taipei, Taiwan
- Seikei University, Graduate School and Faculty of Science and Technology, Information Networking Laboratory, Tokyo, Japan
- Slovak University of Technology, Institute of Telecommunications, Bratislava, Slovak Republic
- Tecnocampus, Escola Universitaria Politecnica de Mataro, Mataro, Spain
- Technical University of Sofia, Faculty of Telecommunications, Sofia, Bulgaria
- Universite Paris 8, UFR MITSIC, Laboratoire d'Informatique Avancee de Saint-Denis (LIASD), France
- University of Ljubljana, Laboratory for Telecommunications, Ljubljana, Slovenia
- University of Osijek, Faculty of Electrical Engineering, Computer Science and Information Technology Osijek, Osijek, Croatia
- University of Patras, Physics Department, Patras, Greece
- VSB - Technical University of Ostrava, Department of Telecommunications, Ostrava, Czech Republic
- West Pomeranian University of Technology, Faculty of Electrical Engineering, Szczecin, Poland


Full Paper Submission: March 5, 2018 (extended deadline)
Notification of Paper Acceptance: April 15, 2018
Final Paper Submission: April 30, 2018
Authors' Early Registration and Payment: May 10, 2018
Authors' Late Registration and Payment: May 20, 2018
Listeners' Registration: July 4, 2018
Conference: July 4-6, 2018



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TSP Organizers reserve the right to exclude a paper from distribution after the Conference (e.g., non-indexing in IEEE Xplore® and other databases) if the paper is not presented at the Conference. However, this paper will be distributed as part of the Conference proceedings issued on an USB drive.

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