IEEE DataCom 2018 : The Fourth IEEE International Conference on Big Data Intelligence and Computing
Call For Papers
Big data is a rapidly expanding research area spanning the fields of computer science and information management, and has become a ubiquitous term in understanding and solving complex problems in different disciplinary fields such as engineering, applied mathematics, medicine, computational biology, healthcare, social networks, finance, business, government, education, transportation and telecommunications. The goal of IEEE DataCom 2018 is to establish an international forum for engineers and scientists to present their ideas and experiences in the fields of Big Data intelligence and computing. IEEE DataCom 2018 welcomes paper submissions on innovative work from researchers in academia, industry and government describing original research work in Big Data. IEEE DataCom 2018 will be held on August 6-10, 2018, co-located with IEEE CyberSciTech 2018, IEEE DASC 2018 and IEEE PICom 2018, in Athens, Greece.
Topics of interest include, but are not limited to:
The 5Vs of the data landscape: volume, variety, velocity, veracity, value
Big data science and foundations, analytics, visualization and semantics
Software and tools for big data management.
Security, privacy and legal issues specific to big data
Big data economy, QoS and business models
Scientific discovery and business intelligenc
Software, hardware and algorithm co-design, high-performance computing
Large-scale recommendation systems and graph analysis
Infrastructures and systems for big data analytics and managements
Middleware and tools for big data analytics and managements
Algorithmic, experimental, prototyping and implementation
Data quality issues: such as validation, metrics, optimizations and consistency
Data-driven innovation, computational modelling and data integration
Data intensive computing theorems and technologies
Big data for advanced manufacturing and productivity
Modelling, simulation and performance evaluation
Green data centers / environmental-friendly perspectives
Computing, scheduling and resource management for sustainability
Complex applications in areas where massive data is generated
Authors are invited to submit their original research work that has not previously been submitted or published in any other venue. Papers should be prepared in IEEE CS format and submitted via the IEEE DataCom 2018 web site,
Proposals for organizing tutorials, workshops and special sessions need to be submitted to the Tutorials, Workshops and Special Sessions Chairs, respectively. A proposal should include title, theme, scope and main presenters/organizers.
Research paper (8 pages) should explore a specific technology problem and propose a complete solution to it, with experimental results.
Works-in-Progess (WiP) (6 pages) papers are expected to present either work currently in progress or less developed but highly innovative ideas.
Demo/Poster papers (4 pages) must describe working systems and be related to DataCom. These systems may be innovative prototype implementations or mature systems that use related technology. Papers/proposals need to be submitted to the Demo/Poster Chair.
Workshop and Special Session papers need to be submitted to the corresponding workshops and special sessions.
All accepted papers in the main tracks, workshops, special sessions and demos/posters will be published in an IEEE Computer Society proceedings (EI indexed). Extended versions of selected excellent papers will be considered for publication in special issues of prestige journals (SCI/EI indexed).
Manish Parashar, Rutgers University, USA
Christos Skourlas, Athens University of Applied Sciences, Greece
General Executive Chairs
Klimis Ntalianis, Athens University of Applied Sciences, Greece
Feng Xia, Dalian University of Technology, China
Cleo Sgouropoulou, Athens University of Applied Sciences, Greece
Maria Ntaliani, Agricultural University of Athens, Greece
Robert Hsu, Chung Hua University, Taiwan
Hai Jin, HUST, China
Jie Li, University of Tsukuba, Japan
Sanjay Ranka, University of Florida, USA
Yuanyuan Yang, Stony Brook University, USA
Anna Kobusinska, Poznan U. of Technology, Poland
Masato Oguchi, Ochanomizu University, Japan
Frank Hsu, Fordam University, USA
Xiaolin Lin, University of Florida, USA
Jinsong Wu, University de Chile, Chile
Song Guo, Poly U., Hong Kong