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COOL Chips 21 2018 : IEEE Symposium on Low-Power and High-Speed Chips and Systems

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Link: http://www.coolchips.org/
 
When Apr 18, 2018 - Apr 20, 2018
Where Yokohama, Japan
Submission Deadline Feb 9, 2018
Notification Due Mar 16, 2018
Final Version Due Mar 30, 2018
Categories    computer architecture   VLSI   microarchitecture    software
 

Call For Papers

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IEEE Symposium on Low-Power and High-Speed Chips and Systems,
COOL Chips 21

Yokohama Joho Bunka Center, Yokohama, Japan
(Yokohama Media & Communications Center, Yokohama, Japan)
April 18 - 20, 2018
http://www.coolchips.org

CALL FOR PAPERS
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Important Dates:

* Technical Papers:
- Feb. 9th, 2018: Extended Abstract Submission (through website)
- Mar. 16th, 2018: Acceptance Notified (by e-mail)
- Mar. 30th, 2018: Final Manuscript Submission

* Posters:
- Mar. 23rd, 2018: Poster Abstract Submission (through website)
- Mar. 26th, 2018: Poster Acceptance Notified (by e-mail)

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COOL Chips is an International Symposium initiated in 1998 to present
advancement of low-power and high-speed chips and systems. The symposium
covers leading-edge technologies in all areas of microprocessors and
their applications. The COOL Chips 21 is to be held in Yokohama on April
18-20, 2018, and is targeted at the architecture, design and implementation
of chips with special emphasis on the areas listed below. All papers are
published online via IEEE Xplore. Especially, selected academic papers
are strongly invited to submit to the special issue on COOL Chips in the
IEEE Transactions on Multi-Scale Computing Systems (TMSCS), and selected
commercial papers are for publication in IEEE Micro.

Contributions are solicited in the following areas:

- Low Power-High Performance Processors for AI, IoT, Multimedia,
Digital Consumer Electronics, Mobile, Graphics, Encryption,
Robotics, Automotive, Networking, Medical, Healthcare, and
Biometrics.

- Novel Architectures and Schemes for Single Core, Multi/Many-Core,
NoC, Embedded Systems, Reconfigurable Computing, Grid, Ubiquitous,
Dependable Computing, GALS and 3D Integration.

- Cool Software including Parallel Schedulers, Embedded Real-time
Operating System, Binary Translations, Compiler Issues and Low Power
Application Techniques.

Proposals should consist of a title, an extended abstract (up to 3
pages) describing the product or topic to be presented and the name,
job title, address, phone number, FAX number, and e-mail address of
the presenter. Please prepare the extended abstract using the given
guidelines and template. We will upload author's kit to
http://www.coolchips.org/ .

In the extended abstract, the status of the product or topic should
precisely be described. If this is a not-yet-announced product, and
you would like to keep the submission confidential, please indicate
it. We will do our best to maintain confidentiality.

Proposals will be selected by the program committee's evaluation of
interest to the audience.

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