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OOPSLA 2018 : SPLASH 2018 OOPSLA

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Link: https://conf.researchr.org/track/splash-2018/splash-2018-OOPSLA
 
When Nov 4, 2018 - Nov 9, 2018
Where Boston, Massachusetts,
Submission Deadline Apr 16, 2018
Notification Due Aug 16, 2018
Final Version Due Aug 28, 2018
 

Call For Papers

PACMPL (OOPSLA) seeks contributions on all aspects of programming languages and software engineering. Authors of papers published in PACMPL will present their work at OOPSLA in Boston.

Papers may target any stage of software development, including requirements, modeling, prototyping, design, implementation, generation, analysis, verification, testing, evaluation, maintenance, and reuse of software systems. Contributions may include the development of new tools (such as language front-ends, program analyses, and runtime systems), new techniques (such as methodologies, design processes, and code organization approaches), new principles (such as formalisms, proofs, models, and paradigms), and new evaluations (such as experiments, corpora analyses, user studies, and surveys).

Call for Papers
Papers appear in an issue of the Proceedings of the ACM on Programming Languages (PACMPL). PACMPL is a Gold Open Access journal, all papers will be freely available to the public. Authors can voluntarily cover the article processing charge (400$), but payment is not required.

Paper Selection Criteria

We consider the following criteria when evaluating papers:

Novelty: The paper presents new ideas and results and places them appropriately within the context established by previous research.

Importance: The paper contributes to the advancement of knowledge in the field. We also welcomes papers that diverge from the dominant trajectory of the field.

Evidence: The paper presents sufficient evidence supporting its claims, such as proofs, implemented systems, experimental results, statistical analyses, case studies, and anecdotes.

Clarity: The paper presents its contributions, methodology and results clearly.

Review Process

A two-stage process with lightweight double-blind reviewing is used to select papers. This FAQ address common concerns.

The first reviewing stage assess papers using the above criteria. At the end of that stage a set of papers is conditionally accepted.

Authors of conditionally accepted papers must make a set of mandatory revisions. The second reviewing phase assesses whether the revisions have been addressed. The expectation is that the revisions can be addressed and that conditionally accepted papers will be accepted in the second phase.

The second submission must be accompanied by a cover letter mapping each mandatory revision request to specific parts of the paper.

Submission Requirements

For double-blind reviewing papers must adhere to two rules:

author names and institutions must be omitted, and
references to authors’ own related work should be in the third person (e.g., not “We build on our previous work …” but rather “We build on the work of …”).
The purpose of this process is to help reviewers come to an initial judgement about the paper without bias, not to make it impossible for them to discover the authors if they were to try. Nothing should be done in the name of anonymity that weakens the submission or makes the job of reviewing the paper more difficult.

Submissions must conform to both the ACM Policies for Authorship and SIGPLAN’s Republication Policy. Authors will be required to sign a license or copyright release.

The official publication date is the date the proceedings are made available in the ACM Digital Library.

Artifact Evaluation

Authors of papers that are conditionally accepted in the first phase of the review process will be encouraged to submit supporting materials for Artifact Evaluation. Authors should indicate with their initial submission if an artifact exists and describe its nature and limitations.

Authors are encouraged to make the supporting materials publicly available upon publication. An additional seal will mark papers whose artifacts are made available, as outlined in the ACM guidelines for artifact badging.

Further information can be found here.

More Information

For additional information, clarification, or answers to questions please contact us at oopsla@splashcon.org.

Related Resources

OOPSLA 2017   Conference on Object-Oriented Programming Systems, Languages, and Applications
SPLASH 2017   ACM SIGPLAN conference on Systems, Programming, Languages and Applications: Software for Humanity
SPLASHDoctSymp 2017   SPLASH Doctoral Symposium 2017