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ICSICT 2010 : 10th IEEE International Conference on Solid-State and Integrated Circuit Technology


When Nov 1, 2010 - Nov 4, 2010
Where Shanghai, China
Submission Deadline Jul 15, 2010
Notification Due Aug 15, 2010
Categories    electron devices

Call For Papers

The ICSICT-2010 conference is the 10th in the series aiming to provide an international forum for the presentation and discussion of recent advances in solid-state and integrated circuit technology. The conference will be held on Nov. 1-4, 2010 in Shanghai, China. All aspects of solid-state devices, circuits, processing technologies, materials and other related research are within the scope of the conference. The three days of contributed and invited presentations on the latest developments in diverse fields given in oral and poster sessions, panel discussions on leading edge technology issues, and other activities will provide extensive opportunities for technical information exchange as well as a stimulating environment for mutual communication among participants. An exhibition of equipment and materials for solid state and integrated circuit technologies will be held concurrently with the conference. In addition, there will be discussions devoted to opportunities for cooperation and joint ventures in the microelectronics business in China. Best Student Paper Award will be presented at the closing of the conference.

The Scope and Topics of the Conference

(Papers are solicited in, but not limited to the following areas)

(1) Silicon integrated circuits and manufacturing

(2) Digital, Analog, Mixed Signal IC and SOC design technology

(3) Low-power, RF devices & circuits

(4) IC Computer-Aided –Design technology

(5) Silicon/germanium devices and device physics

(6) Interconnect, Low K, High K and other process technologies

(7) Advance memories technology (Flash, FeRAM, PCM, ReRAM, MRAM etc.)

(8) Unconventional and nano-electronics

(9) Organic semiconductor devices and technologies

(10) Compound semiconductor devices and circuits

(11) Displays, sensors and MEMS

(12) Semiconductor materials and material characterization

(13) Reliability

(14) Modeling and simulation

(15) Packaging and testing technology

(16) Equipment technology

(17) Solar cell & other devices for new energy sources

(18) Others

Paper Submission

Prospective authors are requested to submit 3 pages camera-ready full length paper in English for proceedings publication. The proceedings will have an IEEE catalogue number and will be collected in IEEE publication database ---- IEEE X’ploreâ.

Deadline for Camera-Ready Full-Length Paper Submission: July 15, 2010

Notification of Acceptance: Aug. 15, 2010

On-line submission at web-site is required.

About paper submission, please contact:

Dr. Yu-Long Jiang

Department of Microelectronics

Fudan University

Shanghai 200433, China


Tel:+86-21-65643768;Fax +86-21-65643768

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