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TechDebt 2018 : First International Conference on Technical Debt

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Link: https://2018.techdebtconf.org/track/TechDebt-2018-papers
 
When May 27, 2018 - May 28, 2018
Where Gothenburg, Sweden
Submission Deadline Jan 15, 2018
 

Call For Papers

First International Conference on Technical Debt
Gothenburg, Sweden, May 27-28 2018
(collocated with ICSE 2018)
https://2018.techdebtconf.org/


SUBMISSION DEADLINES
* January 15th: Abstract submitted to EasyChair
* January 22nd: Full papers entered in EasyChair
* March 1st: Notification of acceptance / rejection
* March 15th: Camera ready submission of final paper
* May 27-28th: Presentations


GOALS
Technical debt is a metaphor that software developers and managers increasingly use to communicate key tradeoffs related to release and quality issues. The Managing Technical Debt workshop series had, since 2010, brought together practitioners and researchers to discuss and define issues related to technical debt and how they can be studied. Workshop participants reiterated the usefulness of the concept each year, shared emerging practices used in software development organizations, and emphasized the need for more research and better means for sharing emerging practices and results.
As the interest from our industry and academic researchers in Technical Debt has steadily grown, the workshop series has morphed into a full conference in 2018. Our goal for this conference on Technical Debt is to bring together leading software engineering researchers and practitioners for the purpose of exploring theoretical and practical techniques for managing technical debt.


SCOPE
The following topics are aligned with the conference theme:
* Identification of technical debt
* Visualization of technical debt
* Analysis of technical debt
* Metrics for technical debt
* Economic models for describing or reasoning about technical debt
* Understanding causes and effects of technical debt
* Relationship of technical debt to software evolution, maintenance, and aging
* Relationship of technical debt with other activities, such as testing or requirement elicitation
* The business case for technical debt management
* Technical debt and software life-cycle management
* Technical debt within a software ecosystem
* Technical debt in designs and architecture
* Technical debt in software models
* Techniques and tools for calculating technical debt principal and interest
* Concrete practices and tools used to measure and control technical debt
* Education related to technical debt


PAPER SUBMISSION
We invite submissions of papers in any areas related to the theme and goal of the conference in the following three categories:
* Research Papers: describing innovative and significant original research in the field (up to 10 pages max.)
* Industrial Papers: describing industrial experience, case studies, challenges, problems, and solutions (up to 10 pages max)
* Short papers: Position and Future Trend Papers: describing ongoing research, new results (up to 5 pages max.)

Submissions must be original and unpublished work. Each submitted paper will undergo a rigorous review process by three members of the program committee. Submissions must be submitted online via the TechDebtConf2018 EasyChair conference management system https://easychair.org/conferences/?conf=techdebt2018 and conform to the ICSE formatting guidelines.

The official publication date is the date the proceedings are made available in the ACM Digital Library. This date may be up to two weeks prior to the first day of ICSE 2018. The official publication date affects the deadline for any patent filings related to published work. Purchases of additional pages in the proceedings is not allowed.

Accepted papers must be presented in person at the conference by one of the authors. Excellent papers will be considered for a Distinguished Paper Award from ACM Sigsoft.


PROGRAM COMMITTEE
Philippe Kruchten, University of British Columbia (Co-chair)
Frank Buschmann, Siemens, Co-chair (Co-chair)
Esra Alzaghoul, University of Jordan
FrancescaArcelli Fontana, University of Milano Bicocca
Paris Avgeriou, University of Groningen
Stephany Bellomo, Software Engineering Institute
Ayse Bener, Ryerson University
Terese Besker, Chalmers University
Christian Bird, Microsoft Research
Jan Bosch, Chalmers University of Technology
Frank Buschmann, Siemens
Alexander Chatzigeorgiou, University of Macedonia
Zadia Codabux, Colby College
Robert Eisenberg, Lockheed Martin
Hakan Erdogmus, Carnegie Mellon University
Davide Falessi, CalPoly
Steven Fraser, Innoxec
Juan Garbajosa, Universidad Politecnica de Madrid (UPM)
Olivier Gaudin, SonarSource
Johannes Holvitie, University of Turku
Clemente Izurieta, Montana State University
Andreas Jedlitschka, Fraunhofer IESE
Sven Johann, innoQ
Heiko Koziolek, ABB Corporate Research
Ville Leppänen, University of Turku
Jean-Louis Letouzey, Inspearit
Alan Maccormack, Harvard
Antonio Martini, Chalmers University of Technology
Andrew Meneely, Rochester Institute of Technology
David Morgenthaler, Google
Ipek Ozkaya, Carnegie Mellon Software Engineering Institute
Jennifer Perez, Technical University of Madrid
Eltjo Poort, CGI
Terri Potts, Raytheon
Narayan Ramasubbu, University of Pittsburgh
Gonzalo Rojas, University of Concepcion
Klaus Schmid, University of Hildesheim
Carolyn Seaman, UMBC
Andriy Shapochka, SoftServe
Emad Shihab, Concordia University
Forrest Shull, Software Engineering Institute
Will Snipes, ABB Corporate Research
Wolfgang Trumler, Siemens AG
Eberhard Wolff, Adesso
Jesse Yli-Huumo, Aalto University
Olaf Zimmermann, HSR FHO

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