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ESTC 2010 : IEEE-CPMT Electronics System Integration Technology Conference


When Sep 13, 2010 - Sep 16, 2010
Where Berlin, Germany
Submission Deadline Feb 1, 2010
Notification Due Apr 1, 2010
Final Version Due Jun 1, 2010
Categories    packaging   microelectronics   system integration

Call For Papers

ESTC 2010 seeks original papers describing research in all areas of electronic packaging. Papers may be submitted to the following tracks:

Advanced packaging
Microsystem packaging
New materials and processes
Assembly and manufacturing technology
Modelling and simulation
Applied reliability
Power electronics
Electrical design and modelling
Emerging technologies

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