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IECON 2010 : 36th Annual Conference of the IEEE Industrial Electronics Society


When Nov 7, 2010 - Nov 10, 2010
Where Glendale-USA
Submission Deadline Apr 26, 2010
Notification Due Jun 12, 2010
Final Version Due Sep 6, 2010
Categories    electronics   industrial

Call For Papers

IECON'10 is an international conference on industrial applications of electronics, control, robotics, signal processing, computational and artificial intelligence, sensors and actuators, instrumentation electronics, computer networks, internet and multimedia technologies. The objectives of the conference are to provide high quality research and professional interactions for the advancement of science, technology, and fellowship. Papers with new research results are encouraged for submission. IECON’10 is being held concurrently with the 4th IEEE International Conference on E-Learning in Industrial Electronics (ICELIE’10). Participation in both conferences just requires the IECON'10 registration fee. Topics of interest include but are not limited to:

Power Electronics & Renewable Energy: Power converters, power electronic devices and systems, integrated power electronics, modelling, simulation and control of power electronics, DC-DC conversion, AC/AC matrix converters, rectifiers, inverters, PWM systems, UPS, active and hybrid filtering, power line conditioners, new power devices, energy efficiency, EMC issues, power quality, wind, solar, wave energy systems, hydro and microhydro power generation, distributed power generation, integrated renewable systems, hybrid electric vehicles, fuel cells, advanced batteries.
Co-Chairs: Francisco Azcondo, Ali Emadi, Hao Ma, Takaharu Takeshita.

Electrical Machines & Drives: AC motor drives, observers and sensorless methods, drive control and applications, electrical machine design and modelling, thermal, noise and vibration issues in electrical machines, testing and diagnostics, fault finding in machines and drives, motion control, special machines and actuators.
Co-Chairs: Babak Fahimi, Franck Betin, Chandan Chakraborty, Mario Pacas.

Control Systems & Applications: Advanced control techniques, computer and microprocessor-based control, nonlinear and adaptive control, optimal and robust control, estimation and identification techniques, intelligent control, vehicular technology control, control in medicine & biology, remote control techniques, industrial applications.
Co-Chairs: Terry Martin, Farhat Fnaiech, Hiroshi Fujimoto, Sehoon Oh, Zdenko Kovacic.

Sensors, Actuators and Systems Integration: Intelligent sensors/actuators and multisensor fusion - Micro-sensors and micro-actuators - Micro-nano technology - Electronic instrumentation - Micro-electro-mechanical systems (MEMS) - Systems on Chip (SoC) - RF systems integration - Integrated optics and related technologies.
Co-Chairs: Antonio Luque Estepa, Marcian Cirstea, Richard Grisel, Kiyoshi Ohishi.

Signal and Image Processing & Computational Intelligence: computer vision, virtual reality systems, industrial vision, virtual instrumentation, image & sound processing, digital signal processing, remote sensing, multimedia applications, neural networks, fuzzy logic, genetic algorithms, industrial applications of intelligent controllers.
Co-Chairs: Seiji Hata, Milos Manic.

Mechatronics & Robotics: Mechatronics systems, robotics, autonomous mobile robots, telerobotics and teleoperation, humanoid robots, multi-robot systems, intelligent transportation, distributed collaborative systems, security & safety applications, human-robot interface, vision-based robots.
Co-Chairs: Makoto Iwasaki, Jang Myung Lee, Ju-Jang Lee, Roberto Oboe.

Factory Automation & Industrial Informatics: Building automation, factory communications, factory automation, flexible manufacturing systems, process automation, industrial agents, integrated systems and processes, distributed collaborative systems, human-machine interfaces, security & safety applications, infrastructures for industrial informatics portable electronics.
Co-Chairs: Sam Kwong, Dietmar Bruckner, Jing Bing Zhang.

Submission of Papers: The working language of the conference is English. Submit the full paper using the following layout. Limitation to 6 full pages, including paper title, authors and affiliations, figures and references (maximum size 2MB). Authors are requested to prepare the manuscripts in the IEEE two-column format, using the template available in the IECON Website and to translate it in PDF using the IEEE PDF eXpress™ facility. No other format in the submission and in the final version can be accepted. For further information, see the web-site: http:

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