posted by system || 3660 views || tracked by 5 users: [display]

ISPD 2010 : International Symposium on Physical Design

FacebookTwitterLinkedInGoogle


Conference Series : International Symposium on Physical Design
 
Link: http://www.ispd.cc/
 
When Mar 14, 2010 - Mar 17, 2010
Where San Francisco, CA, USA
Abstract Registration Due Sep 30, 2009
Submission Deadline Oct 4, 2009
Notification Due Nov 12, 2009
Final Version Due Jan 10, 2010
Categories    design automation
 

Call For Papers

CM International Symposium on Physical Design 2010
http://www.ispd.cc

* IMPORTANT DATES
Title and abstract submission deadline: Midnight, September 30, 2009 (PST)
Full manuscript submission deadline: Midnight, October 4, 2009 (PST)
Acceptance notification: November 12, 2009
Camera-ready paper due: January 10, 2010
Symposium date: March 14 - 17, 2010

Location: Marriott Fisherman's Wharf, San Francisco, California
(Co-located with TAU, March 18 - 19, 2010, http://www.tauworkshop.com)
Sponsored by ACM SIGDA with Technical Co-sponsorship from IEEE CAS

The International Symposium on Physical Design provides a premier forum
to exchange ideas and promote research on critical areas related to the
physical design of VLSI systems. All aspects of physical design,
including its interactions with architecture, behavioral- and logic-level
synthesis, and back-end performance analysis and verification are within
the scope of the symposium. Target domains include semi-custom and
full-custom IC's, regular fabrics, FPGA's, and
systems-on-chip/systems-in-package. Following its eighteen predecessors,
the 2010 symposium will highlight key new directions and leading-edge
theoretical and experimental contributions to the field. The ACM Press
will publish accepted papers in the Symposium proceedings. Topics of
interest include but are not limited to:

- Floorplanning and interconnect planning
- Interactions with behavior-level synthesis flows
- Partitioning, placement and routing
- Interactions with logic-level (re-)synthesis flows
- Physical design for manufacturability and yield
- Analysis and management of power dissipation
- Synthesis optimizations within physical design
- Management of design data and constraints
- Estimation and modeling
- New physical design methodologies
- Timing and crosstalk issues in physical design
- New paradigms in physical design
- Special structures for clocking and power networks
- Circuit performance measurements in a PD context
- Physical design for emerging process technologies
- Multithreaded/distributed algorithms in physical design


* SUBMISSION OF PAPERS

All papers must be submitted electronically. Details will be posted
on the web site http://www.ispd.cc. Potential authors will be required
to submit full-length, original, unpublished papers (a maximum of 8
pages in ACM conference format) along with an abstract of at most 200
words and contact author information (name, street/mailing address,
telephone/fax, e-mail). Previously published or papers concurrently
submitted for publication to other conferences/journals will not be
considered. If one or more related papers have been previously
published elsewhere or have been concurrently submitted elsewhere for
publication, the authors should clearly state the differences between
these papers and the current submission. All submitted papers will be
under blind reviews, and thus they must not include name(s) or
affiliation(s) of the author(s) anywhere in the manuscripts. Failure to
comply with these requirements will result in automatic rejection.

ISPD will recognize excellent contributions through a Best Paper Award.

* SYMPOSIUM ORGANIZATION

General Chair: Prashant Saxena (Synopsys) [Prashant.Saxena@synopsys.com]
Steering Committee Chair: Gi-Joon Nam (IBM) [gnam@us.ibm.com]
Technical Program Chair: Yao-Wen Chang (National Taiwan Univ.) [ywchang@cc.ee.ntu.edu.tw]
Publications Chair: Jiang Hu (Texas A&M Univ.) [jianghu@ece.tamu.edu]
Publicity Chair/Webmaster: Cheng-Kok Koh (Purdue Univ.) [chengkok@purdue.edu]
Contest Chair: Cliff Sze (IBM) [csze@us.ibm.com]

Related Resources

ICDEPI-SCOPUS 2022   5th International Conference on Design Engineering and Product Innovation (ICDEPI 2022)
Shanghai-ICDES 2022   The 7th International Conference on Design Engineering and Science(ICDES 2022)
(IN)TANGIBLE HERITAGE(S) 2022   (IN)TANGIBLE HERITAGE(S): A conference on design, culture and technology – past, present, and future
ISDEA--Ei Compendex, Scopus 2022   2022 International Conference on Intelligent Systems Design and Engineering Applications (ISDEA 2022)--Scopus, Ei Compendex
SASIMI 2022   The 24th Workshop on Synthesis And System Integration of Mixed Information technologies
ICDES 2022   The 7th International Conference on Design Engineering and Science(ICDES 2022)
AI-driven chemistry for drug design 2022   AI-driven chemistry for drug design
A FOCUS ON PEDAGOGY 2022   A FOCUS ON PEDAGOGY: TEACHING, LEARNING AND RESEARCH IN THE MODERN ACADEMY
DIS 2022   Designing Interactive Systems
HEART 2022   2022 : 12th International Symposium on Highly Efficient Accelerators and Reconfigurable Technologies