posted by organizer: edoardo || 545 views || tracked by 1 users: [display]

ACM JETC Emerging NoCs 2017 : ACM JETC Special Issue on Emerging Networks-on-Chip: Designs, Technologies, and Applications


When N/A
Where N/A
Submission Deadline Sep 30, 2017
Notification Due Dec 31, 2017
Final Version Due Feb 28, 2018
Categories    network-on-chip   emerging technologies   silicon photonics

Call For Papers


For decades, Moore’s Law coupled with Dennard scaling has resulted in increasing transistor integration capacity with a constant power density. However, with the end of Dennard scaling, power efficiency in multicore designs has become a concern. Studies have shown that global metallic interconnects will consume significant amounts of power to achieve the communication bandwidth that will be required by future Chip Multi-Processors (CMPs). An energy-efficient inter- and intra-chip communication infrastructure is the key to guarantee the continuous growth of CMPs. Compared to the traditional planar metallic interconnects, emerging technologies such as silicon photonics and wireless can offer unprecedented advantages to the future generations of CMPs. Nevertheless, many challenges should be addressed to exploit the full potential of such alternative interconnect technologies, at any abstraction level, from the very bottom level of device manufacturing to the architecture and system level. The ACM Journal on Emerging Technologies in Computing Systems (JETC) seeks original manuscripts for a special issue on “Emerging Networks-on-Chip: Designs, Technologies, and Applications”, scheduled for publication in July 2018. The purpose of this special issue is to solicit papers discussing the latest advancements in the design and technology of emerging networks-on-chip and evaluate their future prospects. Contributions that include real case studies and applications are especially welcome.


• Emerging networks-on-chip interconnects (silicon photonics, wireless, carbon-based, quantum, superconducting, etc.)
• 3D integration and packaging
• Power- and thermal-aware design of emerging networks-on-chip
• Fault-tolerance and reliability of emerging networks-on-chip
• Application-specific design of emerging networks-on-chip

Submission procedure:

Interested authors should submit their papers to The author guideline
can be found at For further information, please contact Edoardo Fusella
( or Mahdi Nikdast (

Important Dates:

Submission deadline: 30th September, 2017
Reviews completed: 31st December, 2017
Article revisions due: 28th February, 2018
Notice of final acceptance: 31st March, 2018
All materials due to edit: 15th April, 2018
Tentative Publication Date: July 2018

Guest editors:

Edoardo Fusella, University of Naples Federico II
Mahdi Nikdast, Polytechnique Montréal
Ian O’Connor, Ecole Centrale de Lyon
José Flich, Universitat Politècnica de València
Sudeep Pasricha, Colorado State University

Related Resources

CHI 2019   The ACM CHI Conference on Human Factors in Computing Systems
PMES 2018   3rd International Workshop on Post Moore's Era Supercomputing
IUI 2019   ACM Conference on Intelligent User Interfaces
ACM--ICIAI--Ei Compendex and Scopus 2019   ACM--2019 The 3rd International Conference on Innovation in Artificial Intelligence (ICIAI 2019)--Ei Compendex and Scopus
CCGrid 2019   19th IEEE/ACM International Symposium on Cluster, Cloud and Grid Computing
SA-TTA @SAC 2019   The 7th track on Software Architecture: Theory, Technology, and Applications (SA-TTA) at the 34rd ACM/SIGAPP Symposium On Applied Computing (SAC 2019)
ICMLC--ACM, Ei and Scopus 2019   2019 11th International Conference on Machine Learning and Computing (ICMLC 2019)--ACM, Ei Compendex and Scopus
ICSE Workshops 2018   ACM Workshops@International Conference on Software Engineering
DEBS 2019   13th ACM International Conference on Distributed and Event-based Systems
ICSCA--ACM, Ei , Scopus 2019   ACM--2019 8th International Conference on Software and Computer Applications (ICSCA 2019)--Ei Compendex, Scopus