ISMST 2018 : 2018 3rd International Symposium on Material Science and Technology (ISMST 2018)
Call For Papers
2018 3rd International Symposium on Material Science and Technology (ISMST 2018)
Mar. 29-Apr. 1, 2018
2018 3rd International Symposium on Material Science and Technology (ISMST 2018) is organized by Southwest Jiaotong University and Hong Kong Society of Mechanical Engineers (HKSME).
ISMST 2018 will be hosted at Chengdu, China from Mar. 29-Apr. 1, 2018 .
The conference is an international forum for the presentation of technological advances and research results in the fields of Material Science and Technology. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. We warmly welcome prospected authors submit your new research papers to ISMST 2018, and share the valuable experiences with the scientist and scholars around the world.
●Publication and Indexing
1,Paper accepted by ISMST 2018 will be indexed by EI Compendex, Scopus,Thomson Reuters(Wos). which will be indexed by EI Compendex, Scopus, Thomson Reuters (WoS), Inspec, and other indexing organizations. (pending)
2,Selected papers with extension can be recommended to publish InInternational Journal of Advanced Materials and Production (IJAMP)
1.Prof. Stephen M. Hsu
The George Washington University, USA
2.Prof. Minghao Zhu
Southwest Jiaotong University, China
3.Prof. LAU Kin Tak Alan
Swinburne University of Technology, Australia
National University of Singapore, Singapore
●Topics of interest for submission include, but are not limited to:
Iron and Steel
Micro / Nano Materials
Materials forming*Ceramic materials*Surface of Materials
Coatings and surface engineering
New Energy Materials
New Materials and Advanced Materials
Non-ferrous Metal material
Mechanics of Material
You can choose to submit your paper directly to email@example.com
If you have any question, please feel free to contact our conference secretary.
Ms. Suzy Shih
Welcome you to contact us by Email to firstname.lastname@example.org