ICDES 2018 : 2018 3rd International Conference on Design Engineering and Science (ICDES 2018)
Call For Papers
2018 3rd International Conference on Design Engineering and Science (ICDES 2018)
22th-25th, February, 2018
2018 3rd International Conference on Design Engineering and Science (ICDES 2018) will be hosted in Barcelona, Spain during Feb.22 - 25, 2018, in conjunction with IC4M 2018. ICDES 2018 is organized by Hong Kong Society of Mechanical Engineers, technical sponsored by Gent University, MaromeTech and other organizations.
With the continous success of ICDES, we believe that ICDES 2018 will be more exciting and obviously the main annual Design Engineering and Science conference aimed at presenting current research. The idea of the conference is for the scientists, scholars, engineers and students from the universities all around the world and the industry to present ongoing research activities, and hence to foster research relations between the universities and the industry. This conference provides opportunities for the delegates to exchange new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration.
The whole conference committee cordially invite you to this outstanding conference. We look forward to receiving your paper in either research or development of acquired knowledge in order to disseminate to the wider audience. Join us at this event to see other excellent researchers share their work.
●Publication and Indexing
All presented and registered papers of ICDES 2018 will be included in ICDES 2018 conference proceeding, published in the conference proceeding which will be indexed by Ei compendex, ISI, Scopus, etc.
Selected excellent papers with significant extension can be recommended to Journal of Engineering Design for review and publishing. The Journal of Engineering Design is abstracted and indexed in: British Library Inside, Cambridge Scientific Abstracts; EBSCO Databases; Electronic Collections Online; INSPEC®; ISI Current Contents® - Engineering, Computing & Technology; ISI Science Citation Index®; New Jour; OCLC ArticleFirst; PerAbs; Recent Advances in Manufacturing Database (RAM); Scopus™ and Zetoc.
●Topics of interest for submission include, but are not limited to:
Design and Development
Design and Production
Accuracy and Measurement
1.You can choose to submit your paper directly to :firstname.lastname@example.org.
2.You can submit your full paper through electronic submission system:https://cmt3.research.microsoft.com/ICDES2018
If you have any question, please feel free to contact our conference secretary.
Ms. Amber Cao
Tel:+852-30697937( Hong Kong)
( 9:00AM-6:00PM, Monday to Friday)
For general requiry:email@example.com.
For membership: firstname.lastname@example.org.
For complaint: email@example.com.