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ISASE-MAICS 2018 : The 4th International Symposium on Affective Science and Engineering and the 29th Modern Artificial Intelligence and Cognitive Science Conference


When May 31, 2018 - Jun 1, 2018
Where Spokane, WA, USA
Submission Deadline Mar 3, 2018
Notification Due Mar 13, 2018
Final Version Due Mar 23, 2018
Categories    affective science   affective engineering   artificial intelligence   cognitive science

Call For Papers

It is our great pleasure to welcome you to attend ISASE-MAICS 2018 - the 4th International Symposium on Affective Scienceand Engineering and the 29th Modern Artificial Intelligence and Cognitive Science Conference to be held on May 31 (Thu.) and June 1 (Fri.), 2018. The main objective of this joint conference is to bring together academics, engineers, manufacturers, and government officials to present and exchange knowledge, experience, results, and information related to the broad aspects of methodologies employed in affective science and engineering, artificial intelligence, and cognitive science. Affective engineering and artificial intelligence provide a new field and propelling technology that enable us to bridge gaps between humans and systems. The scope of this joint conference covers all fields of advanced technology and science, manufacturing, and production as well as design represented as topics including but not limited to the following:

Affective Science & Engineering
Affective Information
Affective Robotics
Affective Education
Affective Computing
Affective Measurement
Affective Marketing
Affective Business
Affective Design
Affective Innovation
Affective Design Thinking
Affective Ethnography
Emotional Design
UX Design
Fashion Design & Business
Interface Design
Interaction Design
Business Administration
Brand Identity
Designing Pleasure
Culture & Design
Artificial Intelligence
Cognitive Science
Soft Computing
Fuzzy Sets and Logic
Psychology of Cognition
Big Data Treatment

Note to international author(s) who may need (a) visa(s) to enter the United States: Please contact us for an early submission (usually mid January, 2018) + a fast-track peer review so that we will issue a supporting letter upon the acceptance of your paper(s) early enough for the visa application(s).

Professor Hisao Shiizuka, Kogakuin University, Japan. (technical program)
Professor Duanning Zhou, Eastern Washington University, USA. (local arrangement)
Professor Atsushi Inoue, Eastern Washington University, USA. (liaison and publicity)

Related Resources

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ISAIR 2017   The 2nd International Symposium on Artificial Intelligence and Robotics 2017
ICIAE 2018   The 6th IIAE International Conference on Industrial Application Engineering 2018
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