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IEEE DataCom 2017 : The 3rd IEEE International Conference on Big Data Intelligence and Computing

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Link: https://grid.chu.edu.tw/datacom2017/
 
When Nov 6, 2017 - Nov 10, 2017
Where Orlando
Submission Deadline TBD
Categories    big data   HPC   intelligence
 

Call For Papers

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CALL FOR PAPERS
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Big data is a rapidly expanding research area spanning the fields of computer science and information management, and has become a ubiquitous term in understanding and solving complex problems in different disciplinary fields such as engineering, applied mathematics, medicine, computational biology, healthcare, social networks, finance, business, government, education, transportation and telecommunications.

The goal of the 3rd IEEE International Conference on Big Data Intelligence and Computing (IEEE DataCom 2017) is to establish an international forum for engineers and scientists to present their ideas and experiences in the fields of Big Data intelligence and computing. IEEE DataCom 2016 welcomes paper submissions on innovative work from researchers in academia, industry and government describing original research work in Big Data. Authors of selected papers will be invited to submit an extended version (with at least 30% new material) for review and publication in special issues of international journals.

IEEE DataCom 2017 will be held on Nov. 6-10, 2017 in Orlando, Florida, USA. Topics of interest include, but are not limited to:

- The 5Vs of the data landscape: volume, variety, velocity, veracity, value
- Big data science and foundations, analytics, visualization and semantics
- Software and tools for big data management.
- Security, privacy and legal issues specific to big data
- Big data economy, QoS and business models
- Scientific discovery and business intelligence
- Software, hardware and algorithm co-design, high-performance computing
- Large-scale recommendation systems and graph analysis
- Infrastructures and systems for big data analytics and managements
- Middleware and tools for big data analytics and managements
- Algorithmic, experimental, prototyping and implementation
- Data quality issues: such as validation, metrics, optimizations and consistency
- Data-driven innovation, computational modelling and data integration
- Data intensive computing theorems and technologies
- Big data for advanced manufacturing and productivity
- Modeling, simulation and performance evaluation
- Green data centers / environmental-friendly perspectives
- Computing, scheduling and resource management for sustainability
- Complex applications in areas where massive data is generated

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PUBLICATION HIGHLIGHTS
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IEEE CS proceedings, indexed by
- IEEE Xplore
- Scopus
- EI Engineering Index
- ACM Digital Library
- dblp
- Google Scholar

Extended version of the selected papers will be invited for publication in prestigious international journals.
- Future Generation Computer Systems
- Journal of Parallel and Distributed Computing
- International Journal of Big Data Intelligence
- International Journal of Grid and High Performance Computing
- Sustainable Computing: Informatics and Systems
- Applied Computational Intelligence and Soft Computing
- International Journal of Applied Mathematics and Computer Science
- Journal of Supercomputing
- Wireless Communication and Mobile Computing

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IMPORTANT DATES
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Workshop/Special Session notification:
(ongoing as received)

Paper Submission (Research Track):
June 15, 2017

Paper Submission (Works-in-Progress/workshop):
July 10, 2017

Author Notification (Research/workshop/WIP):
July 30, 2017

Paper Submission (Demo /Poster /Special session):
August 5th, 2017

Author Notification (Research/workshop/WIP/Poster):
August 20, 2017

Camera ready / registration deadline:
August 31, 2017

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SUBMISSION
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Authors are invited to submit their original research work that has not previously been submitted or published in any other venue. Papers should be prepared in IEEE CS format and submitted via the IEEE DataCom 2017 web site, https://easychair.org/conferences/?conf=ieeedatacom2017

IEEE formatting information:
http://www.ieee.org/conferences_events/conferences/publishing/templates.html


- Proposals for organizing tutorials, workshops and special sessions need to be submitted to the Tutorials, Workshops and Special Sessions Chairs, respectively. A proposal should include title, theme, scope and main presenters/organizers.
- Research paper (8 pages) should explore a specific technology problem and propose a complete solution to it, with experimental results.
- Works-in-Progess (WIP) (6 pages) papers are expected to present either work currently in progress or less developed but highly innovative ideas.
- Demo/Poster papers (4 pages) must describe working systems and be related to DataCom. These systems may be innovative prototype implementations or mature systems that use related technology. Papers/proposals need to be submitted to the Demo/Poster Chair.
- Workshop and Special Session papers need to be submitted to the corresponding workshops and special sessions.

All accepted papers in the main tracks, workshops, special sessions and demos/posters will be published in an IEEE Computer Society proceedings (EI indexed). Extended versions of selected excellent papers will be considered for publication in special issues of prestige journals (SCI/EI indexed).

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Organizing Committees
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General Chairs

Sanjay Ranka, University of Florida, USA
Hai Jin, HUST, China
Manu Malek, Stevens Inst. of Tech., USA

General Executive Chairs
Jun Wang, University of Central Florida, USA
Tao Li, NSF/UFL, USA

Program Chairs
Anna Kobusinska, Poznan University of Technology, Poland
Xiaolin Li, University of Florida, USA
Wenguang Chen, Tsinghua University, China

Workshop Chairs
I-Hsin Chung, IBM Thomas J. Watson Research Center, USA
Wuu Yang, National Chiao Tung University, Taiwan

Demo/Poster Chair
Che-Rung Lee, Tsing Hua University, Taiwan

Special Session Chair
Hai Jiang, Arkansas State University, USA

Award Chair
Weisong Shi, Wayne State University, USA

International Liaison & Publicity Chair
Bingsheng He, Nanyang Technological University, Singapore
Jun Huang, Chongqing University of Posts and Telecommunications, China
Bahman Javadi, Western Sydney University, Australia
William Liu, Auckland University of Technology, New Zealand
Bhekisipho Twala, Univ. Johannesburg, South Africa
Hao Wang, Aalesund University College, Norway
Sheng-De Wang, National Taiwan University, Taiwan

Publication Chair
Hui-Huang Hsu, Tamkang University, Taiwan

Advisory Committee
Christophe Cérin, University of Paris XIII, France
Yeh-Ching Chung, National Tsing Hua University, Taiwan
Jie Li, University of Tsukuba, Japan
Beniamino Di Martino, Second University of Naples, Italy
Domenico Talia, Università della Calabria, Italy
Vincent S. Tseng, National Chiao Tung Univ. Taiwan
Cho-Li Wang, The Univ. of Hong Kong, Hong Kong
Jinsong Wu, University de Chile, Chile
Jinjun Chen, Swinburne University of Technology, Australia

Steering Committee
Robert Hsu, Chung Hua University, Taiwan
Geoffrey Fox, Indiana University, USA
Yuanyuan Yang, Stony Brook University, USA

Please visit the IEEE DataCom 2017 website http://grid.chu.edu.tw/datacom2017/tpc.php
for the complete listing of organizing committee and TPC members.

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