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COMCAS 2017 : International Conference on Microwaves, Communications, Antennas and Electronic Systems


When Nov 13, 2017 - Nov 15, 2017
Where Tel Aviv, Israel
Submission Deadline May 20, 2017
Notification Due Jul 3, 2017
Final Version Due Sep 4, 2017
Categories    microwaves   communications   antennas   electronic

Call For Papers

IEEE COMCAS 2017 continues the tradition of providing a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electromagnetic compatibility, electron devices, radar, electronic systems engineering and Bio-Medical Engineering. It includes a technical program, industry exhibits, and invited talks by international experts in key topical areas.

The conference will take place on 13-15 November, 2017 in Tel Aviv, Israel. The David Intercontinental Hotel on the Mediterranean sea offers an excellent venue for networking and the candid exchange of ideas.

Important Dates:
Summary submission - May 20, 2017
Notification of Acceptance - July 3, 2017
Final Paper submission - September 4, 2017

Deadline for authors registration - September 10, 2017*
* At least one author of each accepted paper

Papers are solicited in a wide range of topics:

Communications and Sensors

5G systems & millimeter wave propagation
Cognitive Radio & Spectral Sharing
Communications Security
First Responder/Military Communications
Green Communication
Internet of Things
Long Range Low Power Networks
Micro/Pico/Femtocell Devices and Systems
MIMO Antenna Systems for Communications
Modulation & Signal Processing Technologies
On-Body and Short Range Communications
Radio over Fiber & Optical/Wireless Convergence
Sensor Networks and Technologies
Software-Defined Radio & Multiple Access
Space-Time Coding and Systems

Antennas, Propagation, and Scattering

Smart Antennas, Beamforming and MIMO
Wave Propagation and Channel Modeling
Wave Scattering and RCS
NanoEM, Plasmonics, and Applications
Metamaterials, FSS and EBG
EM Field Theory and Numerical Techniques
EM Interference & Compatibility, SI
Spectrum Management and Monitoring
RF, uWave, mmW and THz Measurements

Signal Processing (SP) and Imaging

Microwave Imaging and Tomography
Acoustic/Sonar Imaging and Techniques
Biomedical Image Processing
Radar SP and Imaging, SAR, ATR
MIMO SP for Radar

Ground and Foliage Penetration Systems
Signal Acquisition and Sensor Management
DF, Emitter Location, Elint, Array Processing
Target Detection, Identification and Tracking
Data Fusion
Time Domain and UWB SP

RF/MW Devices and Circuits, RFICs

Solid-State Devices, RFICs
uWave, mmW and Sub-mmW Circuits/Technologies Nano and THz Devices/Technologies
Microwave Photonics
Passive Components and Circuits
Filters and Multiplexers
Ferroelectrics, RF MEMS, MOEMS, and NEMS
Active Devices and Circuits
RF Power Amplifiers and Devices
Tunable and Reconfigurable Circuits/Systems Analog/Digital/Mixed RF circuits
Circuit Theory, Modeling and Applications Interconnects, Packaging and MCM
CAD Techniques for Devices and Circuits
Emerging Technologies
Thermal Management for Devices
Internet of Things

Microwave Systems, Radar, Acoustics

Aeronautical and Space Applications
RFID Devices/Systems/Applications
Automotive/Transportation Radar & Communications
Environmentally Sensitive ("Green") Design
Biomedical Systems and Applications
UWB and Multispectral Technologies & Systems
Emerging System Architectures
Modelling Techniques for RF Systems
Radar Techniques, Systems and Applications
Sonar Systems and Applications
Wireless Power Transfer & Energy Harvesting
Terahertz Systems

Biomedical Engineering

Advances in MRI: Technology, Systems and Applications
Medical RF, MW & MMW Applications and Devices
Medical Imaging and Image Processing

Papers accepted for publication will be presented either as a 20-minute (including Q&A) oral session or as a poster in a poster session. All presentations require the presence of at least one of the authors who must be registered to attend the conference. The conference proceedings will be submitted for inclusion in IEEE Xplore®.

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